SBOS656C July   2016  – December 2016 INA260

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated Shunt Resistor
      2. 8.3.2 Over-Current Capability
      3. 8.3.3 Basic ADC Functions
        1. 8.3.3.1 Power Calculation
        2. 8.3.3.2 ALERT Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
    5. 8.5 Programming
      1. 8.5.1 Calculating Returned Values
      2. 8.5.2 Default Settings
      3. 8.5.3 Communications Bus Overview
        1. 8.5.3.1 Serial Bus Address
        2. 8.5.3.2 Serial Interface
        3. 8.5.3.3 Writing to and Reading From the INA260
          1. 8.5.3.3.1 High-Speed I2C Mode
        4. 8.5.3.4 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h) (Read/Write)
      2. 8.6.2 Current Register (01h) (Read-Only)
      3. 8.6.3 Bus Voltage Register (02h) (Read-Only)
      4. 8.6.4 Power Register (03h) (Read-Only)
      5. 8.6.5 Mask/Enable Register (06h) (Read/Write)
      6. 8.6.6 Alert Limit Register (07h) (Read/Write)
      7. 8.6.7 Manufacturer ID Register (FEh) (Read-Only)
      8. 8.6.8 Die ID Register (FFh) (Read-Only)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

Connections to the internal shunt resistor should be connected directly into and out of the shunt resistor pins to encourage uniform current flow through the device. The trace width should be sized correctly to handle the desired current flow. Place the power-supply bypass capacitor as close as possible to the supply and ground pins. Use of multiple vias to connect the device ground to the bypass capacitor grounds is recommended if there is not direct connection on the top layer.

11.2 Layout Example

INA260 PCBlayout_sbos656.gif
1.

NOTE:

Connect the VBUS pin to the power supply rail.
Figure 33. INA260 Layout Example