SBOS770A May   2017  – June 2017 INA826S

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inside the INA826S
      2. 7.3.2 Setting the Gain
        1. 7.3.2.1 Gain Drift
      3. 7.3.3 Offset Trimming
      4. 7.3.4 Input Common-Mode Range
      5. 7.3.5 Input Protection
      6. 7.3.6 Input Bias Current Return Path
      7. 7.3.7 Reference Pin (REF)
      8. 7.3.8 Shutdown (EN and ENREF) Pins
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Low-Voltage Operation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DRC Package
10-Pin VSON
Top View

Pin Functions

NAME NO. I/O DESCRIPTION
EN 5 I Enable pin; active low with respect to ENREF
ENREF 6 I Enable pin reference
–IN 1 I Negative (inverting) input
+IN 4 I Positive (noninverting) input
OUT 9 O Output
REF 8 I Reference input. This pin must be driven by low impedance.
RG 2, 3 — Gain setting pins. Place a gain resistor between pin 2 and pin 3.
–VS 7 — Negative supply
+VS 10 — Positive supply
Thermal pad Pad — Exposed thermal die pad on underside; connect thermal die pad to V–.
Soldering the thermal pad improves heat dissipation and provides specified performance.