SLLSF22G April   2018  – June 2020 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application Schematic
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics: Driver
    10. 8.10 Electrical Characteristics: Receiver
    11. 8.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 8.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 8.13 Switching Characteristics: Driver
    14. 8.14 Switching Characteristics: Receiver
    15. 8.15 Insulation Characteristics Curves
    16. 8.16 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 10.3.2 Failsafe Receiver
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Glitch-Free Power Up and Power Down
    4. 10.4 Device Functional Modes
      1. 10.4.1 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate and Bus Length
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Bus Loading
      3. 11.2.3 Application Curves
        1. 11.2.3.1 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 PCB Material
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Community Resource
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Compatible with TIA/EIA-485-A
  • PROFIBUS compatible at 5-V bus-side supply
  • Bus I/O protection
    • ± 30 kV HBM
    • ±16 kV IEC 61000-4-2 Contact discharge
    • ± 4 kV IEC 61000-4-4 Electrical fast transient
  • Low-EMI 500-kbps, 12 Mbps and 50 Mbps Data Rates
  • 1.71-V to 5.5-V logic-side supply (VCC1), 3-V to 5.5-V bus-side supply (VCC2)
  • Failsafe receiver for bus open, short, and idle
  • 1/8 Unit load up to 256 nodes on bus
  • 100-kV/µs (typical) high common-mode transient immunity
  • Extended temperature range from –40°C to +125°C
  • Glitch-free power-up and power-down for hot plug-in
  • Wide-body SOIC-16 package
  • Pin compatible to most isolated RS-485 transceivers
  • Safety-related certifications:
    • 7071-VPK VIOTM and 1500-VPK VIORM (reinforced and basic options) per DIN VDE V 0884-11:2017-01
    • 5000-VRMS isolation for 1 minute per UL 1577
    • IEC 60950-1, IEC 62368-1, IEC 60601-1 and IEC 61010-1 certifications
    • CQC, TUV, and CSA approvals