SLLSEN5C june   2015  – may 2023 ISO5851

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Description (continued)
  7. Pin Configuration and Function
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Characteristics
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and Active Miller Clamp
      2. 9.3.2 Active Output Pulldown
      3. 9.3.3 Undervoltage Lockout (UVLO) With Ready (RDY) Pin Indication Output
      4. 9.3.4 Fault ( FLT) and Reset ( RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5851 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Insulation Characteristics

PARAMETERTEST CONDITIONSSPECIFICATIONUNIT
CLRExternal clearance(1)Shortest terminal-to-terminal distance through air8mm
CPGExternal creepage(1)Shortest terminal-to-terminal distance across the package surface8mm
DTIDistance through the insulationMinimum internal gap (internal clearance)21μm
CTIComparative tracking indexDIN EN 60112 (VDE 0303-11); IEC 60112; UL 746A>600V
Material groupAccording to IEC 60664-1I
Overvoltage category per IEC 60664-1Rated mains voltage ≤ 600 VRMSI-IV
Rated mains voltage ≤ 1000 VRMSI-III
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12(2)
VIORMMaximum repetitive peak isolation voltageAC voltage (bipolar)2121VPK
VIOWMMaximum isolation working voltageAC voltage. Time dependent dielectric breakdown (TDDB) Test, see Figure 7-11500VRMS
DC voltage2121VDC
VIOTMMaximum Transient isolation voltageVTEST = VIOTM, t = 60 sec (qualification), t = 1 sec (100% production)8000VPK
VIOSMMaximum surge isolation voltage(3)Test method per IEC 60065, 1.2/50 μs waveform,
VTEST = 1.6 x VIOSM = 12800 VPK (qualification)
8000
qpdApparent charge(4)Method a: After I/O safety test subgroup 2/3,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.2 × VIORM = 2545 VPK,
tm = 10 s
≤5pC
Method a: After environmental tests subgroup 1,
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.6 × VIORM = 3394 VPK,
tm = 10 s
≤5
Method b1: At routine test (100% production) and preconditioning (type test)
Vini = VIOTM, tini = 60 s;
Vpd(m) = 1.875× VIORM = 3977 VPK,
tm = 10 s
≤5
RIOIsolation resistance, input to output(5)VIO = 500 V at TS> 109
VIO = 500 V, TA = 25°C>1012
VIO = 500 V, 100°C ≤ TA ≤ 125°C>1011
CIOBarrier capacitance, input to output(5)VIO = 0.4 x sin (2πft), f = 1 MHz~1pF
Pollution degree2
Climatic category40/125/21
UL 1577
VISOWithstanding Isolation voltageVTEST = VISO, t = 60 sec (qualification),
VTEST = 1.2 × VISO = 6840 VRMS, t = 1 sec (100% production)
5700VRMS
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by means of suitable protective circuits.
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
Apparent charge is electrical discharge caused by a partial discharge (pd).
All pins on each side of the barrier tied together creating a two-terminal device.