SLLSFV3B December   2025  – August 2026 ISO6040 , ISO6041 , ISO6042

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   5
  6. 4 Device Comparison
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics-5V Supply
    10. 6.10 Supply Current Characteristics-5V Supply
    11. 6.11 Electrical Characteristics-3.3V Supply
    12. 6.12 Supply Current Characteristics-3.3V Supply
    13. 6.13 Electrical Characteristics-2.5V Supply 
    14. 6.14 Supply Current Characteristics-2.5V Supply
    15. 6.15 Electrical Characteristics-1.8V Supply 
    16. 6.16 Supply Current Characteristics-1.8V Supply
    17. 6.17 Switching Characteristics-5V Supply
    18. 6.18 Switching Characteristics-3.3V Supply
    19. 6.19 Switching Characteristics-2.5V Supply
    20. 6.20 Switching Characteristics-1.8V Supply
    21. 6.21 Insulation Characteristics Curves
    22. 6.22 Typical Characteristics
  9.   31
  10. 7 Parameter Measurement Information
  11. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
    5. 8.5 Device I/O Schematics
    6. 8.6 Overvoltage Tolerant Input
  12. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  13. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Device Nomenclature
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  14. 11Revision History
  15. 12Mechanical, Packaging, and Orderable Information
    1.     62
    2.     63
    3.     64

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DW|16
  • DFP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1 Design Requirements

To design with these devices, use the parameters listed in Table 9-1.

Table 9-1 Design Parameters
PARAMETERVALUE
Supply voltage, VCC1 and VCC21.71V to 5.5V
Decoupling capacitor between VCC1 and GND10.1µF
Decoupling capacitor from VCC2 and GND20.1µF