SLLSFK0C August   2021  – November 2021 ISO6760 , ISO6761 , ISO6762 , ISO6763

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 6.9  Supply Current Characteristics—5-V Supply
    11. 6.10 Electrical Characteristics—3.3-V Supply
    12. 6.11 Supply Current Characteristics—3.3-V Supply
    13. 6.12 Electrical Characteristics—2.5-V Supply 
    14. 6.13 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 6.14 Supply Current Characteristics—1.8-V Supply
    17. 6.15 Switching Characteristics—5-V Supply
    18. 6.16 Switching Characteristics—3.3-V Supply
    19. 6.17 Switching Characteristics—2.5-V Supply
    20. 6.18 Switching Characteristics—1.8-V Supply
    21. 6.19 Insulation Characteristics Curves
    22. 6.20 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Package Option Addendum

Packaging Information

Orderable DeviceStatus(1)Package TypePackage DrawingPinsPackage QtyEco Plan(2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp (°C)Device Marking(4)(5)
ISO6760DWRACTIVESOICDW162000Green (RoHS & no Sb/Br)NIPDAULevel-2-260C-1 YEAR--40 to 125ISO6760
ISO6760FDWR

ACTIVE

SOIC

DW

16

2000

Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6760F
ISO6761DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6761
ISO6761FDWR

ACTIVE

SOIC

DW

16

2000

Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6761F
ISO6762DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6762
ISO6762FDWR

ACTIVE

SOIC

DW

16

2000

Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6762F
ISO6763DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) NIPDAU Level-2-260C-1 YEAR --40 to 125 ISO6763
ISO6763FDWR

ACTIVE

SOIC

DW

16

2000

Green (RoHS & no Sb/Br)NIPDAULevel-2-260C-1 YEAR--40 to 125ISO6763F