SLLSFN3 June   2022 ISO7041-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
    1.     Device Comparison Table
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6.     Insulation Specifications
    7. 6.6  Safety-Related Certifications
    8. 6.7  Safety Limiting Values
    9. 6.8  Electrical Characteristics 5V Supply
    10. 6.9  Supply Current Characteristics 5V Supply
    11. 6.10 Electrical Characteristics 3.3V Supply
    12. 6.11 Supply Current Characteristics 3.3V Supply
    13. 6.12 Switching Characteristics
    14. 6.13 Insulation Characteristics Curves
    15. 6.14 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Refresh
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Insulation Lifetime
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Functional Modes

Table 8-1 shows the functional modes for the device.

Table 8-1 Function Table
VCCI(1) VCCO INPUT
(INx)
REFRESH ENABLE
(ENx)
OUTPUT
(OUTx)
COMMENTS
PU PU H L H Normal Operation:
A channel output assumes the logic state of its input.
L L L
X H Undetermined The device needs an input signal transition to validate the output tracks the input state. Without a signal edge transition, the output will be in an undetermined state.
PD PU X L Default When VCCI is unpowered, a channel output assumes the logic state based on the selected default option. Default is High for the device without the F suffix and Low for device with the F suffix.
When VCCI transitions from unpowered to powered-up, a channel output assumes the logic state of the input.
When VCCI transitions from powered-up to unpowered, channel output assumes the selected default state.
H Undetermined When VCCI is unpowered, a channel output assumes the logic state based on the previous state of the output before VCCI powered down.
X PD X L Undetermined When VCCO is unpowered, a channel output is undetermined.(2)
When VCCO transitions from unpowered to powered-up, a channel output assumes the logic state of the input.
H Undetermined When VCCO is unpowered, a channel output is undetermined.(2)
When VCCO transitions from unpowered to powered-up, a channel output assumes the selected default option.
X X X Open Undetermined When ENx is unconnected or open, the device output will be in an undetermined and unknown state. ENx must be connected high or low for the device to behave correctly.
VCCI = Input-side VCC; VCCO = Output-side VCC; PU = Powered up (VCC ≥ 1.54 V); PD = Powered down (VCC ≤ 1.54); X = Irrelevant; H = High level; L = Low level ; Z = High Impedance.
A strongly driven input signal can weakly power the floating VCC through an internal protection diode and cause undetermined output.