SLLSEU7D November   2018  – January 2024 ISO7760-Q1 , ISO7761-Q1 , ISO7762-Q1 , ISO7763-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (Continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8.   Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Insulation Lifetime
  11. 9 Power Supply Recommendations
  12. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Material
    2. 10.2 Layout Example
  13. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  14. 12Revision History
  15. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision C (October 2022) to Revision D (January 2024)

  • Added table note to Data rate specificationGo
  • Changed VIORM value for DW-16 package from "1414 VPK" to "2121 VPK Go
  • Changed VIOWM values for DW-16 package from "1000 VRMS" and "1414 VDC" to "1500 VRMS" and "2121 VDC"Go
  • Updated certification informationGo

Changes from Revision B (October 2020) to Revision C (October 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the document.Go
  • Changed standard name from: "DIN V VDE V 0884-11:2017-01" To: "DIN EN IEC 60747-17 (VDE 0884-17)" throughout the documentGo
  • Removed references to standard IEC/EN/CSA 60950-1 throughout the documentGo
  • Updated Thermal characteristics, Safety Limiting Values, and Thermal derating Curves to provide more accurate system-level thermal calculations.Go
  • Updated electrical and switching characteristics to match device performance.Go
  • Changed the CIO value for the DBQ package from 1.1 to 0.9 pFGo
  • Changed working voltage lifetime margin From: 87.5% To: 50%, minimum required insulation lifetime From: 37.5 years To: 30 years and insulation lifetime per TDDB From: 135 years To: 169 years in Insulation Lifetime per DIN EN IEC 60747-17 (VDE 0884-17)Go
  • Changed Figure 9-7 per DIN EN IEC 60747-17 (VDE 0884-17)Go

Changes from Revision A (February 2019) to Revision B (October 2020)

  • Added Functional Safety Bullets.Go
  • Added the maximum transient isolation voltage for the DW-16 package of the ISO7761, ISO7762, and ISO7763 devices and changed the maximum value for the DBQ-16 package from 3600 to 4242 for all devicesGo
  • Changed table note and table condition of safety limiting valuesGo

Changes from Revision * (November 2018) to Revision A (February 2019)