SNIS232 October   2023 ISOTMP35

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Insulation Specification
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Integrated Isolation Barrier and Thermal Response
      2. 7.3.2 Analog Output
        1. 7.3.2.1 Output Accuracy
        2. 7.3.2.2 Output Voltage Linearity
        3. 7.3.2.3 Drive Capability
      3. 7.3.3 Thermal Response
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Voltage Linearity
      2. 8.1.2 Load Regulation
      3. 8.1.3 Start-Up Settling Time
      4. 8.1.4 Thermal Response
      5. 8.1.5 External Buffer
      6. 8.1.6 ADC Selection and Impact on Accuracy
      7. 8.1.7 Implementation Guidelines
      8. 8.1.8 PSRR
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DFQ|7
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The ISOTMP35 is the industry’s first isolated temperature sensor IC, combining an integrated isolation barrier, up to 3000 VRMS withstand voltage, with an analog temperature sensor featuring a 10 mV/°C slope from –40°C to +150°C. This integration enables the sensor to be co-located with high voltage heat source (for example: HV FETs, IGBTs, or HV contactors) without requiring expensive isolation circuitry. The direct contact with the high-voltage heat source also provides greater accuracy and faster thermal response compared approaches where the sensor is placed further away to meet isolation requirements.

Operating from a non-isolated 2.3-V to 5.5-V supply, the ISOTMP35 allows easy integration into applications where sub-regulated power is not available on the high-voltage plane.

The integrated isolation barrier satisfies UL 1577 requirements. The surface mount package (7-pin SOIC) provides excellent heat flow from the heat source to the embedded thermal sensor, minimizing thermal mass and providing more accurate heat-source measurement. This reduces the need for time-consuming thermal modeling and improves system design margin by reducing mechanical variations due to manufacturing and assembly.

The ISOTMP35 class-AB output driver provides a strong 500-μA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface with analog-to-digital converter (ADC) sample and hold inputs.

Packaging Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
ISOTMP35DFQ (SOIC, 7) 4.9 mm × 6 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20220701-SS0I-0JDC-JP1L-HRHJQL6DTWQK-low.svgFunctional Block Diagram
GUID-20220701-SS0I-K4B5-6LJP-BXLSFWRFFWC1-low.svgTypical Application