SWRS237 April   2020 IWR6843AOP

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-3 PAD IO Register Bit Descriptions
    3. 4.3 Signal Descriptions
      1. Table 4-4 Pin Functions - Digital and Analog [ALP Package]
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Supply Specifications
    6. 5.6  Power Consumption Summary
    7. 5.7  RF Specification
    8. 5.8  CPU Specifications
    9. 5.9  Thermal Resistance Characteristics for FCBGA Package [ALP0180A]
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1  Antenna Radiation Patterns
        1. 5.10.1.1 Antenna Radiation Patterns for Transmitter
        2. 5.10.1.2 Antenna Radiation Patterns for Receiver
      2. 5.10.2  Antenna Positions
      3. 5.10.3  Power Supply Sequencing and Reset Timing
      4. 5.10.4  Input Clocks and Oscillators
        1. 5.10.4.1 Clock Specifications
      5. 5.10.5  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.10.5.1 Peripheral Description
        2. 5.10.5.2 MibSPI Transmit and Receive RAM Organization
          1. Table 5-6 SPI Timing Conditions
          2. Table 5-7 SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. Table 5-8 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 5.10.5.3 SPI Slave Mode I/O Timings
          1. Table 5-9 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 5.10.5.4 Typical Interface Protocol Diagram (Slave Mode)
      6. 5.10.6  LVDS Interface Configuration
        1. 5.10.6.1 LVDS Interface Timings
      7. 5.10.7  General-Purpose Input/Output
        1. Table 5-11 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      8. 5.10.8  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. Table 5-12 Dynamic Characteristics for the CANx TX and RX Pins
      9. 5.10.9  Serial Communication Interface (SCI)
        1. Table 5-13 SCI Timing Requirements
      10. 5.10.10 Inter-Integrated Circuit Interface (I2C)
        1. Table 5-14 I2C Timing Requirements
      11. 5.10.11 Quad Serial Peripheral Interface (QSPI)
        1. Table 5-15 QSPI Timing Conditions
        2. Table 5-16 Timing Requirements for QSPI Input (Read) Timings
        3. Table 5-17 QSPI Switching Characteristics
      12. 5.10.12 ETM Trace Interface
        1. Table 5-18 ETMTRACE Timing Conditions
        2. Table 5-19 ETM TRACE Switching Characteristics
      13. 5.10.13 Data Modification Module (DMM)
        1. Table 5-20 DMM Timing Requirements
      14. 5.10.14 JTAG Interface
        1. Table 5-21 JTAG Timing Conditions
        2. Table 5-22 Timing Requirements for IEEE 1149.1 JTAG
        3. Table 5-23 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Subsystems
      1. 6.3.1 RF and Analog Subsystem
        1. 6.3.1.1 Clock Subsystem
        2. 6.3.1.2 Transmit Subsystem
        3. 6.3.1.3 Receive Subsystem
      2. 6.3.2 Processor Subsystem
      3. 6.3.3 Host Interface
      4. 6.3.4 Master Subsystem Cortex-R4F
      5. 6.3.5 DSP Subsystem
      6. 6.3.6 Hardware Accelerator
    4. 6.4 Other Subsystems
      1. 6.4.1 ADC Channels (Service) for User Application
        1. Table 6-1 GP-ADC Parameter
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Reference Schematic
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
      3. 7.3.3 Stackup Details
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALP|180
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview