11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
184.108.40.206 Definition of Terms
Input offset voltage:That voltage which must be applied between the input terminals to bias the unloaded output in the linear region.
Input offset current:The difference in the currents at the input terminals when the unloaded output is in the linear region.
Input bias current:The absolute value of the average of the two input currents.
Input resistance:The ratio of the change in input voltage to the change in input current on either input with the other grounded.
Large signal voltage gain:The ratio of the specified output voltage swing to the change in differential input voltage required to produce it.
Shunt gain:The ratio of the specified output voltage swing to the change in differential input voltage required to produce it with the output tied to the V+ terminal of the IC. The load and power source are connected between the V+ and V− terminals, and input common-mode is referred to the V− terminal.
Common-mode rejection:The ratio of the input voltage range to the change in offset voltage between the extremes.
Supply-voltage rejection:The ratio of the specified supply-voltage change to the change in offset voltage between the extremes.
Line regulation:The average change in reference output voltage over the specified supply voltage range.
Load regulation:The change in reference output voltage from no load to that load specified.
Feedback sense voltage: The voltage, referred to V−, on the reference feedback terminal while operating in regulation.
Reference amplifier gain:The ratio of the specified reference output change to the change in feedback sense voltage required to produce it.
Feedback current: The absolute value of the current at the feedback terminal when operating in regulation.
Supply current:The current required from the power source to operate the amplifier and reference with their outputs unloaded and operating in the linear range.
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation, see the following:
AN-211 New Op Amp Ideas, SNOA638
11.3 Community Resources
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11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.