SNVS120G April   2000  – May 2019 LM2585

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      12-V Flyback Regulator Design Example
  4. 4 Revision History
  5. 5 Pin Configurations
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Ratings
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 3.3 V
    6. 6.6  Electrical Characteristics: 5 V
    7. 6.7  Electrical Characteristics: 12-V
    8. 6.8  Electrical Characteristics: Adjustable
    9. 6.9  Electrical Characteristics: All Versions
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Step-Up (Boost) Regulator Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Boost Regulator Applications
      2. 8.2.2 Typical Flyback Regulator Applications
        1. 8.2.2.1 Transformer Selection (T)
        2. 8.2.2.2 Transformer Footprints
          1. 8.2.2.2.0.1 T6
          2. 8.2.2.2.0.2 T6
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
        1. 8.2.4.1 Custom Design With WEBENCH® Tools
        2. 8.2.4.2 Programming Output Voltage (Selecting R1 And R2)
        3. 8.2.4.3 Short Circuit Condition
        4. 8.2.4.4 Flyback Regulator Input Capacitors
        5. 8.2.4.5 Switch Voltage Limits
        6. 8.2.4.6 Output Voltage Limitations
        7. 8.2.4.7 Noisy Input Line Condition
        8. 8.2.4.8 Stability
      5. 8.2.5 Application Curve
    3. 8.3 Additional Application Examples
      1. 8.3.1 Test Circuits
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Heat Sink/Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
Input Voltage −0.4 V ≤ VIN ≤ 45 V
Switch Voltage −0.4 V ≤ VSW ≤ 65 V
Switch Current (3) Internally Limited
Compensation Pin Voltage −0.4 V ≤ VCOMP ≤ 2.4 V
Feedback Pin Voltage −0.4 V ≤ VFB ≤ 2 V
Storage Temperature Range −65°C to +150°C
Lead Temperature  (Soldering, 10 sec.) 260°C
Maximum Junction Temperature(4) 150°C
Power Dissipation (4) Internally Limited
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to be functional, but device parameter specifications may not be specified under these conditions. For specifications and test conditions see Electrical Characteristics: All Versions.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the LM2585 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3 A. However, output current is internally limited when the LM2585 is used as a flyback regulator (see Typical Flyback Regulator Applications for more information).
(4) The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance (θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the device is less than: PD ≤ [TJ(MAX) − TA(MAX))]/θJA. When calculating the maximum allowable power dissipation, derate the maximum junction temperature—this ensures a margin of safety in the thermal design.