SNVS077J May   2004  – June 2016 LM2677

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 3.3 V
    6. 6.6  Electrical Characteristics - 5 V
    7. 6.7  Electrical Characteristics - 12 V
    8. 6.8  Electrical Characteristics - Adjustable
    9. 6.9  Electrical Characteristics - All Output Voltage Versions
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switch Output
      2. 7.3.2 CBoost
      3. 7.3.3 Ground
      4. 7.3.4 Sync
      5. 7.3.5 Feedback
      6. 7.3.6 ON/OFF
      7. 7.3.7 DAP (VSON Package)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inductor
      2. 8.1.2 Output Capacitor
      3. 8.1.3 Input and Output Capacitor Codes
      4. 8.1.4 Input Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Boost Capacitor
      7. 8.1.7 SYNC Components
      8. 8.1.8 Additional Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Fixed Output Voltage Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Adjustable Output Voltage Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VSON Package Devices
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6 Specifications

6.1 Absolute Maximum Ratings

over recommended operating junction temperature range of –40°C to 125°C (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input supply voltage 45 V
ON/OFF pin voltage –0.1 6 V
Switch voltage to ground(3) –1 VIN V
Boost pin voltage VSW + 8 V
Feedback pin voltage –0.3 14 V
Power dissipation Internally limited
Soldering temperature Wave (4 s) 260 °C
Infrared (10 s) 240
Vapor phase (75 s) 219
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The switch voltage to ground specification applies to DC voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 20 ns, –6 V of 60 ns, and –3 V of up to 100 ns.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) ESD was applied using the human-body model, a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 8 40 V
TJ Junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM2677 UNIT
KTW (TO-263) NDZ (TO-220) NHM (VSON)
7 PINS 7 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance See(2) 56 — — °C/W
See(3) 35 — —
See(4) 26 — —
See(5) — 65 —
See(6) — 45 —
See(7) — — 55
See(8) — — 29
RθJC(top) Junction-to-case (top) thermal resistance 2 2 — °C/W
RθJB Junction-to-board thermal resistance — — — °C/W
ψJT Junction-to-top characterization parameter — — — °C/W
ψJB Junction-to-board characterization parameter — — — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Junction to ambient thermal resistance for the 7-pin DDPAK/TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(3) Junction to ambient thermal resistance for the 7-pin DDPAK/TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(4) Junction to ambient thermal resistance for the 7-pin DDPAK/TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further.
(5) Junction to ambient thermal resistance (no external heat sink) for the 7-pin TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.
(6) Junction to ambient thermal resistance (no external heat sink) for the 7-pin TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the pins.
(7) Junction to ambient thermal resistance for the 14-pin VSON mounted on a PC board copper area equal to the die attach paddle.
(8) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PC board copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area reduces thermal resistance further. For layout recommendations, refer to Application Note, AN-1187 Leadless Leadframe Package (LLP).

6.5 Electrical Characteristics – 3.3 V

TJ = 25°C, sync pin open circuited (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1)   TYP(2)   MAX(1)   UNIT
VOUT Output voltage VIN = 8 V to 40 V, 100 mA ≤ IOUT ≤ 5 A TJ = 25°C 3.234 3.3 3.366 V
TJ = –40°C to 125°C 3.201 3.399
η Efficiency VIN = 12 V, ILOAD = 5 A 82%
(1) All limits are ensured at room temperature and at temperature extremes. All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are ensured through correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.6 Electrical Characteristics – 5 V

TJ = 25°C, sync pin open circuited (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1)   TYP(2)   MAX(1)   UNIT
VOUT Output voltage VIN = 8 V to 40 V, 100 mA ≤ IOUT ≤ 5 A TJ = 25°C 4.9 5 5.1 V
TJ = –40°C to 125°C 4.85 5.15
η Efficiency VIN = 12 V, ILOAD = 5 A 84%
(1) All limits are ensured at room temperature and at temperature extremes. All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are ensured through correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.7 Electrical Characteristics – 12 V

TJ = 25°C, sync pin open circuited (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1)   TYP(2)   MAX(1)   UNIT
VOUT Output voltage VIN = 15 V to 40 V, 100 mA ≤ IOUT ≤ 5 A TJ = 25°C 11.76 12 12.24 V
TJ = –40°C to 125°C 11.64 12.36
η Efficiency VIN = 24 V, ILOAD = 5 A 92%
(1) All limits are ensured at room temperature and at temperature extremes. All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are ensured through correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.8 Electrical Characteristics – Adjustable

TJ = 25°C, sync pin open circuited (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1)   TYP(2)   MAX(1)   UNIT
VFB Feedback voltage VIN = 8 V to 40 V, 100 mA ≤ IOUT ≤ 5 A,
VOUT programmed for 5 V		 TJ = 25°C 1.186 1.21 1.234 V
TJ = –40°C to 125°C 1.174 1.246
η Efficiency VIN = 12 V, ILOAD = 5 A 84%
(1) All limits are ensured at room temperature and at temperature extremes. All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are ensured through correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.9 Electrical Characteristics – All Output Voltage Versions

TJ = 25°C, VIN= 12 V for the 3.3-V, 5-V, and Adjustable versions, VIN = 24 V for the 12-V version, sync pin open circuited (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
IQ Quiescent current VFEEDBACK = 8 V for 3.3-V, 5-V, and adjustable versions, VFEEDBACK = 15 V for 12-V versions 4.2 6 mA
ISTBY Standby quiescent current ON/OFF pin = 0 V TJ = 25°C 50 100 μA
TJ = –40°C to 125°C 150
ICL Current limit TJ = 25°C 6.1 7 8.3 A
TJ = –40°C to 125°C 5.75 8.75
IL Output leakage current VIN = 40 V, ON/OFF pin = 0 V 1 200 μA
VSWITCH = 0 V 15
VSWITCH = –1 V 6 mA
RDS(ON) Switch on-resistance ISWITCH = 5 A TJ = 25°C 0.12 0.14 Ω
TJ = –40°C to 125°C 0.225
fO Oscillator frequency Measured at switch pin TJ = 25°C 260 kHz
TJ = –40°C to 125°C 225 280
D Duty cycle Maximum duty cycle 91%
Minimum duty cycle 0%
IBIAS Feedback bias current VFEEDBACK = 1.3 V, ADJ version only 85 nA
VON/OFF ON/OFF threshold voltage TJ = 25°C 1.4 V
TJ = –40°C to 125°C 0.8 2
ION/OFF ON/OFF input current ON/OFF input = 0 V TJ = 25°C 20 μA
TJ = –40°C to 125°C 45
FSYNC Synchronization frequency VSYNC(pin 5) = 3.5 V, 50% duty cycle 400 kHz
VSYNC SYNC threshold voltage 1.4 V
(1) All limits are ensured at room temperature and at temperature extremes. All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are ensured through correlation using standard standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical values are determined with TA = TJ = 25°C and represent the most likely norm.

6.10 Typical Characteristics

LM2677 10130109.png Figure 1. Normalized Output Voltage
LM2677 10130111.png Figure 3. Efficiency vs Input Voltage
LM2677 10130104.png Figure 5. Switch Current Limit
LM2677 10130140.png Figure 7. Standby Quiescent Current
LM2677 10130114.png Figure 9. ON/OFF Pin Current (Sourcing)
LM2677 10130116.png
Figure 11. Feedback Pin Bias Current
LM2677 10130118.png
VSW pin voltage, 10 V/div VIN = 20 V, VOUT = 5 V,
Inductor current, 1 A/div ILOAD = 500 mA,
L = 10 μH,
Output ripple voltage,
20 mV/div AC-coupled		 COUT = 400 μF,
COUTESR = 13 mΩ
Figure 13. Discontinuous Mode Switching Waveforms, Horizontal Time Base: 1 μs//iv
LM2677 10130120.png
Output voltage, 100 mV//div, VIN = 20 V, VOUT = 5 V,
AC-coupled L = 10 μH,
Load current: 200 mA
to 5-A load pulse		 COUT = 400 μF,
COUTESR = 13 mΩ
Figure 15. Load Transient Response for Discontinuous Mode, Horizontal Time Base: 200 μs/div
LM2677 10130110.png Figure 2. Line Regulation
LM2677 10130112.png Figure 4. Efficiency vs ILOAD
LM2677 10130105.png Figure 6. Operating Quiescent Current
LM2677 10130113.png Figure 8. ON/OFF Threshold Voltage
LM2677 10130115.png Figure 10. Switching Frequency
LM2677 10130117.png
VSW pin voltage, 10 V/div VIN = 20 V, VOUT = 5 V,
Inductor current, 2 A/div ILOAD = 5 A, L = 10 μH,
Output ripple voltage,
20 mV/div AC-coupled		 COUT = 400 μF,
COUTESR = 13 mΩ
Figure 12. Continuous Mode Switching Waveforms, Horizontal Time Base: 1 μs/div
LM2677 10130119.png
Output voltage, VIN = 20 V, VOUT = 5 V,
100 mV//div,
AC-coupled		 L = 10 μH,
Load current: 500 mA
to 5-A load pulse		 COUT = 400 μF,
COUTESR = 13 mΩ
Figure 14. Load Transient Response for Continuous Mode, Horizontal Time Base: 100 μs/div