SNIS144G July   2007  – September 2016 LM26LV , LM26LV-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM26LV
    3. 6.3 ESD Ratings: LM26LV-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Accuracy Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM26LV and LM26LV-Q1 VTEMP vs Die Temperature Conversion Table
      2. 7.3.2 VTEMP vs Die Temperature Approximations
        1. 7.3.2.1 The Second-Order Equation (Parabolic)
        2. 7.3.2.2 The First-Order Approximation (Linear)
        3. 7.3.2.3 First-Order Approximation (Linear) Over Small Temperature Range
      3. 7.3.3 OVERTEMP and OVERTEMP Digital Outputs
        1. 7.3.3.1 OVERTEMP Open-Drain Digital Output
          1. 7.3.3.1.1 Determining the Pullup Resistor Value
            1. 7.3.3.1.1.1 Example Calculation
      4. 7.3.4 TRIP_TEST Digital Input
      5. 7.3.5 VTEMP Analog Temperature Sensor Output
        1. 7.3.5.1 Noise Considerations
        2. 7.3.5.2 Capacitive Loads
        3. 7.3.5.3 Voltage Shift
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Noise Immunity
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Mounting and Temperature Conductivity
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

Bypass capacitors are optional, and maybe required if the supply line is extremely noisy at high frequencies. TI recommends that a local supply decoupling capacitor be used to reduce noise. For noisy environments, TI recommends a 100-nF supply decoupling capacitor placed closed across the VDD and GND pins of the LM26LV or LM26LV-Q1.

9.1 Power Supply Noise Immunity

The LM26LV and LM26LV-Q1 are virtually immune from false triggers on the OVERTEMP and OVERTEMP digital outputs due to noise on the power supply. Test have been conducted showing that, with the die temperature within 0.5°C of the temperature trip point, and the severe test of a 3 V***pp square wave "***noise" signal injected on the VDD line, with VDD from 2 V to 5 V, there were no false triggers.