SNVS353F February   2005  – September 2016 LM2753

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Flash LED Selection
      3. 7.3.3 PFM Regulation
      4. 7.3.4 Output Voltage Ripple
      5. 7.3.5 IOUT Pin
        1. 7.3.5.1 Setting Flash Current
        2. 7.3.5.2 Setting Torch Current
      6. 7.3.6 PWM Brightness Control Procedures
      7. 7.3.7 Multi-Level Switch Array
      8. 7.3.8 Thermal Protection
      9. 7.3.9 Power Efficiency
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Mode
      2. 7.4.2 Flash Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitors
        2. 8.2.2.2 Power Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN pin: voltage to GND –0.3 6 V
EN, FLASH pins: voltage to GND –0.3 (VIN + 0.3) w/ 6 V maximum V
Continuous power dissipation(3) Internally limited
Junction temperature, TJ-MAX-ABS 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 120°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Machine model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(2)
MIN MAX UNIT
Input voltage 3 5.5 V
EN, FLASH input voltage 0 VIN V
Junction temperature, TJ –40 120 °C
Ambient temperature, TA(3) –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) LM2753 UNIT
DSC (WSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 52.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.0 °C/W
RθJB Junction-to-board thermal resistance 27.2 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 27.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.3 °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

6.5 Electrical Characteristics

Unless otherwise noted, specifications apply to the Simplified Schematic with TA = 25°C, VIN = 3.6 V, V(EN) = VIN,
V(FLASH) = GND, C1 = 1 µF, CIN = COUT = 10 µF.(1) (2).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOUT Output voltage 3 V ≤ VIN ≤ 5.5 V, IOUT ≤ 100 mA 5 V
3 V ≤ VIN ≤ 5.5 V, IOUT ≤ 100 mA
–40°C ≤ TA ≤ 85°C		 4.75 (–5%) 5.25 (5%)
IVOUT Continuous load current 3 V ≤ VIN ≤ 5.5 V, VOUT = 5 V (typical) 200 mA
IOUT Pulsed flash current V(FLASH) = 1.8 V, TPULSE = 500 ms
VIOUT-MAX = 4.1 V (typical)		 400 mA
IQ Quiescent current IOUT = 0 mA, 3 V ≤ VIN ≤ 5.5 V 60 µA
IOUT = 0 mA, 3 V ≤ VIN ≤ 5.5 V
–40°C ≤ TA ≤ 85°C		 80
ISD Shutdown supply current V(EN) = 0 V
3 V ≤ VIN ≤ 5.5 V		 0.1 1 µA
V(EN) = 0 V, 3 V ≤ VIN ≤ 5.5 V
TA = 85°C		 0.2
ROUT Output impedance VIN = 3.2 V 5.3 Ω
ƒSW Switching frequency 3 V ≤ VIN ≤ 5.5 V 725 kHz
3 V ≤ VIN ≤ 5.5 V, –40°C ≤ TA ≤ 85°C 475 950
VIH Logic input high Input pins: EN, FLASH, –40°C ≤ TA ≤ 85°C 1.2 VIN V
VIL Logic input low Input pins: EN, FLASH, –40°C ≤ TA ≤ 85°C 0 0.3 V
IIH Logic input high current V(EN) = V(FLASH) = 3 V 10 µA
IIL Logic input low current V(EN) = V(FLASH) = 0 V 10 nA
tON Turnon time(3) 640 µs
tFLASH Flash turnon time(4) V(FLASH) = 3.6 V 10 ns
(1) Minimum (MIN) and maximum (MAX) limits are specified by design, test, or statistical analysis. Typical (TYP) numbers are not specified, but represent the most likely norm.
(2) CIN, COUT, and C1: Low-ESR surface-mount ceramic capacitors (MLCCs) are used in setting electrical characteristics.
(3) Turnon time is measured from when the EN signal is pulled high until the output voltage on VOUT crosses 90% of its final value.
(4) Flash turnon time is measured from when the FLASH signal is pulled high until the voltage on IOUT crosses 90% of its final programmed value.

6.6 Typical Characteristics

Unless otherwise specified: TA = 25°C, VIN = 3.6 V, V(FLASH) = GND, V(EN) = VIN, CIN = COUT = 10 µF, C1 = 1 µF.
LM2753 20140611.gif
Figure 1. Quiescent Current vs Input Voltage
LM2753 20140612.gif
Figure 2. Oscillator Frequency vs Input Voltage