SNVSA11A August   2013  – June 2014 LM3290

PRODUCTION DATA.  

  1. 1Features
  2. 2Description
  3. 3Device and Documentation Support
    1. 3.1 Trademarks
    2. 3.2 Electrostatic Discharge Caution
    3. 3.3 Glossary
  4. 4Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFQ|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device and Documentation Support

3.1 Trademarks

MIPI is a registered trademark of Mobile Industry Processor Interface Alliance.

All other trademarks are the property of their respective owners.

3.2 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.