SNVS574G July   2008  – July 2019 LM3421 , LM3423

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Boost Application
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Current Regulators
      2. 8.3.2  Predictive Off-Time (PRO) Control
      3. 8.3.3  Average LED Current
      4. 8.3.4  Analog Dimming
      5. 8.3.5  Current Sense and Current Limit
      6. 8.3.6  Overcurrent Protection
      7. 8.3.7  Zero Current Shutdown
      8. 8.3.8  Control Loop Compensation
      9. 8.3.9  Start-Up Regulator
      10. 8.3.10 Overvoltage Lockout (OVLO)
      11. 8.3.11 Input Undervoltage Lockout (UVLO)
        1. 8.3.11.1 UVLO Only
        2. 8.3.11.2 PWM Dimming and UVLO
      12. 8.3.12 PWM Dimming
      13. 8.3.13 LM3423 Only: DPOL, FLT, TIMR, and LRDY
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Inductor
      2. 9.1.2 LED Dynamic Resistance
      3. 9.1.3 Output Capacitor
      4. 9.1.4 Input Capacitors
      5. 9.1.5 Main MOSFET / Dimming MOSFET
      6. 9.1.6 Re-Circulating Diode
      7. 9.1.7 Boost Inrush Current
      8. 9.1.8 Switching Frequency
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Topology Schematics
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Operating Point
          2. 9.2.1.2.2  Switching Frequency
          3. 9.2.1.2.3  Average LED Current
          4. 9.2.1.2.4  Inductor Ripple Current
          5. 9.2.1.2.5  LED Ripple Current
          6. 9.2.1.2.6  Peak Current Limit
          7. 9.2.1.2.7  Loop Compensation
          8. 9.2.1.2.8  Input Capacitance
          9. 9.2.1.2.9  N-channel FET
            1. 9.2.1.2.9.1 Boost and Buck-Boost
          10. 9.2.1.2.10 Diode
          11. 9.2.1.2.11 Output OVLO
          12. 9.2.1.2.12 Input UVLO
          13. 9.2.1.2.13 PWM Dimming Method
          14. 9.2.1.2.14 Analog Dimming Method
      2. 9.2.2 LM3421 Buck-Boost Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1  Operating Point
          2. 9.2.2.2.2  Switching Frequency
          3. 9.2.2.2.3  Average LED Current
          4. 9.2.2.2.4  Inductor Ripple Current
          5. 9.2.2.2.5  Output Capacitance
          6. 9.2.2.2.6  Peak Current Limit
          7. 9.2.2.2.7  Loop Compensation
          8. 9.2.2.2.8  Input Capacitance
          9. 9.2.2.2.9  N-channel FET
          10. 9.2.2.2.10 Diode
          11. 9.2.2.2.11 Input UVLO
          12. 9.2.2.2.12 Output OVLO
        3. 9.2.2.3 Application Curve
      3. 9.2.3 LM3421 BOOST Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 LM3421 Buck-Boost Application
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 LM3423 Boost Application
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
      6. 9.2.6 LM3421 Buck-Boost Application
        1. 9.2.6.1 Design Requirements
        2. 9.2.6.2 Detailed Design Procedure
      7. 9.2.7 LM3423 Buck Application
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
      8. 9.2.8 LM3423 Buck-Boost Application
        1. 9.2.8.1 Design Requirements
        2. 9.2.8.2 Detailed Design Procedure
      9. 9.2.9 LM3421 SEPIC Application
        1. 9.2.9.1 Design Procedure
        2. 9.2.9.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 General Recommendations
    2. 10.2 Input Supply Current Limit
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)
MIN MAX UNIT
VIN, EN, RPD, nDIM –0.3 76 V
–1 continuous mA
OVP, HSP, HSN, LRDY, FLT, DPOL –0.3 76 V
–100 continuous  µA
RCT –0.3 76 V
–1 continuous 5 continuous mA
IS –0.3 76 V
–2 for 100 ns
–1 continuous mA
VCC –0.3 8 V
TIMR –0.3 7 V
–100 continuous 100 continuous µA
COMP, CSH –0.3 6 V
–200 continuous 200 continuous µA
GATE, DDRV –0.3 VCC V
–2.5 for 100 ns VCC+ 2.5 for 100 ns
–1 continuous 1 continuous mA
PGND –0.3 0.3 V
–2.5 for 100 ns 2.5 for 100 ns
Continuous power dissipation Internally Limited
Maximum junction temperature Internally Limited
Maximum lead temperature (solder and reflow) (2) 260 °C
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Refer to http://www.ti.com/packaging for more detailed information and mounting techniques.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications.