SNVSAX8A April   2018  – June 2025 LM3478Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Overvoltage Protection
      2. 6.3.2 Slope Compensation Ramp
      3. 6.3.3 Frequency Adjust/Shutdown
      4. 6.3.4 Short-Circuit Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical High Efficiency Step-Up (Boost) Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1  Custom Design with WEBENCH Tools
          2. 7.2.1.2.2  Power Inductor Selection
          3. 7.2.1.2.3  Programming the Output Voltage
          4. 7.2.1.2.4  Setting the Current Limit
          5. 7.2.1.2.5  Current Limit with External Slope Compensation
          6. 7.2.1.2.6  Power Diode Selection
          7. 7.2.1.2.7  Power MOSFET Selection
          8. 7.2.1.2.8  Input Capacitor Selection
          9. 7.2.1.2.9  Output Capacitor Selection
          10. 7.2.1.2.10 Compensation
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical SEPIC Converter
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Power MOSFET Selection
          2. 7.2.2.2.2 Power Diode Selection
          3. 7.2.2.2.3 Selection of Inductors L1 and L2
          4. 7.2.2.2.4 Sense Resistor Selection
          5. 7.2.2.2.5 Sepic Capacitor Selection
          6. 7.2.2.2.6 Input Capacitor Selection
          7. 7.2.2.2.7 Output Capacitor Selection
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Development Support
      1. 8.2.1 Custom Design with WEBENCH Tools
    3. 8.3 Documentation Support
      1. 8.3.1 Related Documentation
    4. 8.4 Receiving Notification of Documentation Updates
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision * (April 2018) to Revision A (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Updated values of thermal tableGo
  • Updated values of IEAO Go