SNVS891H September   2012  – September 2015 LM3642

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Amplifier Synchronization (TX/TORCH)
      2. 7.3.2 Input Voltage Flash Monitor (IVFM)
      3. 7.3.3 Fault and Protections
        1. 7.3.3.1 Fault Operation
        2. 7.3.3.2 Flash Time-Out
        3. 7.3.3.3 Overvoltage Protection (OVP)
        4. 7.3.3.4 Current Limit
        5. 7.3.3.5 Undervoltage Lockout (UVLO)
        6. 7.3.3.6 Thermal Shutdown (TSD)
        7. 7.3.3.7 LED and/or VOUT Fault
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up (Enabling the Device)
      2. 7.4.2 Pass Mode
      3. 7.4.3 Flash Mode
      4. 7.4.4 Torch Mode
      5. 7.4.5 Indicator Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Transferring Data
    6. 7.6 Register Map
      1. 7.6.1 Register Descriptions
        1. 7.6.1.1 Enable Register (0x0A)
        2. 7.6.1.2 Flags Register (0x0B)
        3. 7.6.1.3 Flash Features Register (0x08)
        4. 7.6.1.4 Current Control Register (0x09)
        5. 7.6.1.5 Input Voltage Flash Monitor (IVFM) Mode Register (0x01)
        6. 7.6.1.6 Torch Ramp Time Register (0x06)
        7. 7.6.1.7 Silicon Revision Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Capacitor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Inductor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Community Resources
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (December 2014) to H Revision

  • Changed Handling Ratings table to ESD Ratings table per SDS format; move Storage Temp to Abs Max table Go
  • Added "If an I2C command is used to terminate the flash event, TI recommends selecting a flash time-out level 100 ms above the desired flash duration ." to end of Flash Time-Out subsectionGo

Changes from F Revision (December 2013) to G Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added updated full Thermal InformationGo

Changes from E Revision (May 2013) to F Revision

  • Deleted TX interruptGo