SNAS276 Data sheet

SNAS276G May 2005 – September 2015 LM4550B

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

PT|48
- MTQF003C

Thermal pad, mechanical data (Package|Pins)

Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
Supply Voltage				6	V
Storage Temperature			–65	150	°C
Input Voltage			–0.3	V_DD 0.3	V
Junction Temperature				150	°C
Soldering Information	LQFP Package	Vapor Phase (60 sec.)		215	°C
Soldering Information	LQFP Package	Infrared (15 sec.)		220	°C
Storage temperature, T_stg					°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

				VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾	All pins except 3	±2000	V
		Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾	Pin 3	±750
		Machine Model⁽³⁾	All pins except 3	±200
		Machine Model⁽³⁾	Pins 3	±100

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) Human body model, 100 pF discharged through a 1.5-kΩ resistor.

(3) Machine Model, 220 pF to 240 pF discharged through all pins.

7.3 Recommended Operating Comditions

	MIN	NOM	MAX	UNIT
Temperature Range (−40°C ≤ T_A ≤ 85°C)	T_MIN	T_A	T_MAX⁽¹⁾	°C
Analog Supply Range	4.2	AV_DD	5.5	V
Digital Supply Range	3	DV_DD	5.5	V

(1) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_JMAX, R_θJA, and the ambient temperature T_A. The maximum allowable power dissipation is P_DMAX = (T_JMAX– T_A)/R_θJA or the number given in Absolute Maximum Ratings, whichever is lower. For the LM4550B, T_JMAX = 150°C. The typical junction-to-ambient thermal resistance is 74°C/W for package number PT.

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM4550B	UNIT
		PT (LQFP)
		48 PINS
R_θJA	Junction-to-ambient thermal resistance	74	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

The following specifications apply for AV_DD = 5V, DV_DD = 3.3 V, Fs = 48 kHz, single codec configuration, (primary mode) unless otherwise noted. Limits apply for T_A= 25°C. The reference for 0 dB is 1 Vrms unless otherwise specified.⁽¹⁾⁽²⁾

PARAMETER		TEST CONDITIONS	MIN	TYP⁽³⁾	MAX⁽⁴⁾	UNIT
AV_DD	Analog Supply Range		4.2		5.5	V
DV_DD	Digital Supply Range		3		5.5	V
D_IDD	Digital Quiescent Power Supply Current	DV_DD = 5 V		34		mA
D_IDD	Digital Quiescent Power Supply Current	DV_DD = 3.3 V		19		mA
A_IDD	Analog Quiescent Power Supply Current	AV_DD = 5 V		53		mA
I_DSD	Digital Shutdown Current	PR6543210 = 1111111		19		µA
I_ASD	Analog Shutdown Current	PR6543210 = 1111111		70		µA
V_REF	Reference Voltage	No pullup resistor		2.16		V
PSRR	Power Supply Rejection Ratio			40		dB
ANALOG LOOPTHROUGH MODE⁽⁵⁾
	Dynamic Range ⁽⁶⁾	CD Input to Line Output, –60 dB Input THD+N	90	97		dB
THD	Total Harmonic Distortion	V_O= –3 dB, f = 1 kHz, R_L = 10 kΩ		0.013%	0.02%
ANALOG INPUT SECTION
V_IN	Line Input Voltage	LINE_IN, AUX, CD, VIDEO, PC_BEEP, PHONE		1		Vrms
V_IN	Mic Input with 20-dB Gain			0.1		Vrms
V_IN	Mic Input with 0-dB Gain			1		Vrms
Xtalk	Crosstalk	CD Left to Right		−95		dB
Z_IN	Input Impedance ⁽⁶⁾	All Analog Inputs	10	40		kΩ
C_IN	Input Capacitance⁽⁶⁾			3.7	7	pF
	Interchannel Gain Mismatch	CD Left to Right		0.10		dB
RECORD GAIN AMPLIFIER - ADC
A_S	Step Size	0 dB to 22.5 dB		1.5		dB
A_M	Mute Attenuation ⁽⁶⁾			86		dB
MIXER SECTION
A_S	Step Size	12 dB to –34.5 dB		1.5		dB
A_M	Mute Attenuation⁽⁶⁾			86		dB
ANALOG TO DIGITAL CONVERTERS
	Resolution			18		Bits
	Dynamic Range ⁽⁶⁾	–60-dB Input THD+N, A-Weighted	86	90		dB
	Frequency Response	–1-dB Bandwidth		20		kHz
DIGITAL TO ANALOG CONVERTERS
	Resolution			18		Bits
	Dynamic Range ⁽⁶⁾	–60-dB Input THD+N, A-Weighted	82	89		dB
THD	Total Harmonic Distortion	V_IN = –3 dB, f = 1 kHz, R_L = 10 kΩ		0.01%
	Frequency Response			20-21k		Hz
	Group Delay ⁽⁶⁾	Sample Freq. = 48 kHz		0.36	1	ms
	Out of Band Energy ⁽⁷⁾			-40		dB
	Stop Band Rejection			70		dB
D_T	Discrete Tones			-96		dB
ANALOG OUTPUT SECTION
A_S	Step Size	0 dB to –46.5 dB		1.5		dB
A_M	Mute Attenuation⁽⁶⁾			86		dB
THD+N	Headphone Amplifier Total Harmonic Distortion plus Noise	Loopthrough Mode⁽⁵⁾, R_L = 32 Ω, f = 1 kHz, P_out= 50 mW		0.02%
Z_OUT	Output Impedance⁽⁶⁾	HP_OUT_L, HP_OUT_R		0.65	2.75	Ω
Z_OUT	Output Impedance⁽⁶⁾	LINE_OUT_L, LINE_OUT_R, MONO_OUT		220	500	Ω
DIGITAL I/O⁽⁶⁾
V_IH	High level input voltage		0.65 x DV_DD			V
V_IL	Low level input voltage				0.35 x DV_DD	V
V_OH	High level output voltage	I_O = –2.5 mA.	0.90 x DV_DD			V
V_OL	Low level output voltage	I_O = 2.5 mA.			0.10 x DV_DD	V
I_L	Input Leakage Current	AC Link inputs			±10	µA
I_L	Tri state Leakage Current	High impedance AC Link outputs			±10	µA
Cin	AC-Link I/O capacitance	SDout, BitClk, SDin, Sync, Reset# only		4	7.5	pF
I_DR	Output drive current	AC Link outputs		5		mA

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance.

(2) All voltages are measured with respect to the ground pin, unless otherwise specified.

(3) Typicals are measured at 25°C and represent the parametric norm.

(4) Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(5) Loopthrough Mode describes a path from an analog input through the analog mixers to an analog output.

(6) These specifications are ensured by design and characterization; they are not production tested.

(7) Out of band energy is measured from 28.8 kHz to 100 kHz relative to a 1 Vrms DAC output.

7.6 Timing Requirements

			MIN	NOM	MAX	UNIT
DIGITAL TIMING SPECIFICATIONS⁽¹⁾
F_BC	BIT_CLK frequency			12.288		MHz
T_BCP	BIT_CLK period			81.4		ns
T_CH	BIT_CLK high	Variation of BIT_CLK duty cycle from 50%			±20%
F_SYNC	SYNC frequency			48		kHz
T_SP	SYNC period			20.8		µs
T_SH	SYNC high pulse width			1.3		µs
T_SL	SYNC low pulse width			19.5		µs
T_DSETUP	Setup Time for codec data input	SDATA_OUT to falling edge of BIT_CLK	10	3.5		ns
T_DHOLD	Hold Time for codec data input	Hold time of SDATA_OUT from falling edge of BIT_CLK⁽¹⁾	10	5.3		ns
T_SSETUP	Setup Time for codec SYNC input	SYNC to falling edge of BIT_CLK⁽¹⁾	10	3.8		ns
T_SHOLD	Hold Time for codec SYNC input	Hold time of SYNC from falling edge of BIT_CLK	10			ns
T_CO	Output Valid Delay	Output Delay of SDATA_IN from rising edge of BIT_CLK⁽¹⁾		5.2	15	ns
T_RISE	Rise Time	BIT_CLK, SYNC, SDATA_IN or SDATA_OUT			6	ns
T_FALL	Fall Time	BIT_CLK, SYNC, SDATA_IN or SDATA_OUT			6	ns
T_{RST_LOW}	RESET# active low pulse width	For Cold Reset	1			µs
T_RST2CLK	RESET# inactive to BIT_CLK start-up	For Cold Reset	162.8	271		ns
T_SH	SYNC active high pulse width	For Warm Reset	1			µs
T_SYNC2CLK	SYNC inactive to BIT_CLK start-up	For Warm Reset	162.8			ns
T_{S2_PDOWN}	AC Link Power-Down Delay	Delay from end of Slot 2 to BIT_CLK, SDATA_IN low			1	µs
T_SUPPLY2RST	Power On Reset	Time from minimum valid supply levels to end of Reset	1			µs
T_SU2RST	Setup to trailing edge of RESET#	For ATE Test Mode	15			ns
T_RST2HZ	Rising edge of RESET# to Hi-Z	For ATE Test Mode			25	ns