SNIS118I July   1999  – October 2025 LM50 , LM50HV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM50 (LM50B and LM50C)
    6. 6.6 Electrical Characteristics: LM50HV
    7. 6.7 Typical Characteristics (LM50B and LM50C)
    8. 6.8 Typical Characteristics (LM50HV)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM50 and LM50HVTransfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitive Bypass and Loads
          2. 8.2.1.2.2 LM50HV Self-heating
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5.2 Layout Example

LM50 LM50HV PCB LayoutFigure 8-13 PCB Layout
LM50 LM50HV Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves LM50 (Legacy Chip)Figure 8-14 Printed-Circuit Board Used for Heat Sink to Generate Thermal Response Curves LM50 (Legacy Chip)
LM50 LM50HV Printed-Circuit Board Used to Generate Thermal Response Curves [New Test Setup for LM50 (New Chip and Legacy Chip) and LM50HV]Figure 8-15 Printed-Circuit Board Used to Generate Thermal Response Curves [New Test Setup for LM50 (New Chip and Legacy Chip) and LM50HV]