SNVS252H September   2003  – November 2018 LM5007

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
      2. 7.3.2 High-Voltage Bias Supply Regulator
      3. 7.3.3 Overvoltage Comparator
      4. 7.3.4 On-Time Generator and Shutdown
      5. 7.3.5 Overcurrent Protection
      6. 7.3.6 N-Channel Buck Switch and Driver
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Minimum Load Current
      9. 7.3.9 Ripple Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode with VIN
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Custom Design With Excel Quickstart Tool
        3. 8.2.2.3 Feedback Resistors, RFB1 and RFB2
        4. 8.2.2.4 Switching Frequency Selection, RON
        5. 8.2.2.5 Buck Inductor, L1
        6. 8.2.2.6 Output Capacitor, COUT
        7. 8.2.2.7 Type I Ripple Circuit, RC
        8. 8.2.2.8 Input Capacitor, CIN
        9. 8.2.2.9 Current Limit, RCL
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Custom Design With WEBENCH® Tools
      3. 11.1.3 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 PCB Layout Resources
        2. 11.2.1.2 Thermal Design Resources
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM5007 UNIT
DGK (VSSOP) NGT (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 158.3 38.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.3 27.8 °C/W
RθJB Junction-to-board thermal resistance 78.5 15.1 °C/W
ψJT Junction-to-top characterization parameter 4.9 0.2 °C/W
ψJB Junction-to-board characterization parameter 77.2 15.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).