|VIN, UVLO to RTN||–0.3||100||V|
|SW to RTN||–1.5||VIN + 0.3||V|
|SW to RTN (100-ns transient)||–5||VIN + 0.3||V|
|BST to VCC||100||V|
|BST to SW||13||V|
|RON to RTN||–0.3||100||V|
|VCC to RTN||–0.3||13||V|
|FB to RTN||–0.3||5||V|
|Maximum junction temperature(2)||150||°C|
|Storage temperature, Tstg||–55||150||°C|(1) Absolute Maximum Ratings
are limits beyond which damage to the device may occur. Section 6.3
are conditions under which operation of the device is intended to be functional. For verified specifications and test conditions, see Section 6.5
. The RTN pin is the GND reference electrically connected to the substrate.
(2) High junction temperatures degrade operating lifetimes. Operating lifetime is derated for junction temperatures greater than 125°C.