SNVSCV0A September   2024  – June 2025 LM5137F-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Related Products
  6. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Third-Party Products Disclaimer
      2. 5.1.2 Development Support
        1. 5.1.2.1 Custom Design With WEBENCH® Tools
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
        1. 5.2.1.1 Low-EMI Design Resources
        2. 5.2.1.2 Thermal Design Resources
        3. 5.2.1.3 PCB Layout Resources
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.