SNVSA67B December   2016  – June 2017 LM5166

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Integrated Power MOSFETs
      2. 7.3.2  Selectable PFM or COT Mode Converter Operation
        1. 7.3.2.1 PFM Mode Operation
        2. 7.3.2.2 COT Mode Operation
          1. 7.3.2.2.1 Ripple Generation Methods
          2. 7.3.2.2.2 COT Mode Light-Load Operation
      3. 7.3.3  Low Dropout Operation and 100% Duty Cycle Mode
      4. 7.3.4  Adjustable Output Voltage (FB)
      5. 7.3.5  Adjustable Current Limit
      6. 7.3.6  Precision Enable (EN) and Hysteresis (HYS)
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Configurable Soft Start (SS)
      9. 7.3.9  Short-Circuit Operation
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode - COT
      4. 7.4.4 Sleep Mode - COT
      5. 7.4.5 Active Mode - PFM
      6. 7.4.6 Sleep Mode - PFM
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Wide VIN, Low IQ, High-Efficiency COT Converter Rated at 5 V, 500 mA
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Feedback Resistors - RFB1, RFB2
          3. 8.2.1.2.3 Switching Frequency - RT
          4. 8.2.1.2.4 Filter Inductance - LF
          5. 8.2.1.2.5 Output Capacitors - COUT
          6. 8.2.1.2.6 Ripple Generation Network - RESR, CFF
          7. 8.2.1.2.7 Input Capacitor - CIN
          8. 8.2.1.2.8 Soft-Start Capacitor - CSS
          9. 8.2.1.2.9 Application Curves
      2. 8.2.2 Design 2: Wide VIN, Low IQ COT Converter Rated at 3.3 V, 500 mA
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Feedback Resistors - RFB1, RFB2
          2. 8.2.2.2.2 Switching Frequency - RT
          3. 8.2.2.2.3 Filter Inductance - LF
          4. 8.2.2.2.4 Output Capacitors - COUT
          5. 8.2.2.2.5 Ripple Generation Network - RESR
          6. 8.2.2.2.6 Input Capacitor - CIN
          7. 8.2.2.2.7 Soft-Start Capacitor - CSS
          8. 8.2.2.2.8 Application Curves
      3. 8.2.3 Design 3: High-Density PFM Converter Rated at 3.3 V, 0.3 A
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Peak Current Limit Setting - RILIM
          2. 8.2.3.2.2 Switching Frequency - LF
          3. 8.2.3.2.3 Output Capacitors - COUT
          4. 8.2.3.2.4 Input Capacitor - CIN
          5. 8.2.3.2.5 Application Curves
      4. 8.2.4 Design 4: Wide VIN, Low IQ PFM Converter Rated at 5 V, 500 mA
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Feedback Resistors - RFB1, RFB2
          2. 8.2.4.2.2 Peak Current Limit Setting - RILIM
          3. 8.2.4.2.3 Switching Frequency - LF
          4. 8.2.4.2.4 Output Capacitors - COUT
          5. 8.2.4.2.5 Input Capacitor - CIN
        3. 8.2.4.3 Application Curves
      5. 8.2.5 Design 5: 12-V, 300-mA COT Converter Operating From 24-V or 48-V Input
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
          1. 8.2.5.2.1 Peak Current Limit Setting - RILIM
          2. 8.2.5.2.2 Switching Frequency - RRT
          3. 8.2.5.2.3 Inductor - LF
          4. 8.2.5.2.4 Input and Output Capacitors - CIN, COUT
          5. 8.2.5.2.5 Feedback Resistors - RFB1, RFB2
          6. 8.2.5.2.6 Ripple Generation Network - RA, CA, CB
          7. 8.2.5.2.7 Undervoltage Lockout Setpoint - RUV1, RUV2, RHYS
          8. 8.2.5.2.8 Soft Start - CSS
        3. 8.2.5.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact PCB Layout for EMI Reduction
      2. 10.1.2 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
      3. 11.1.3 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

11.1.3 Custom Design With WEBENCH® Tools

Click here to create a custom design using the LM5166 device with the WEBENCH® Power Designer.

  1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
  2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
  3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability.

In most cases, these actions are available:

  • Run electrical simulations to see important waveforms and circuit performance
  • Run thermal simulations to understand board thermal performance
  • Export customized schematic and layout into popular CAD formats
  • Print PDF reports for the design, and share the design with colleagues

Get more information about WEBENCH tools at www.ti.com/WEBENCH.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.