SNVSCQ8A November   2025  – June 2026 LM654B0-Q1

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Output Voltage Selection
      2. 7.3.2  EN Pin and Use as VIN UVLO
      3. 7.3.3  Device Configuration
      4. 7.3.4  Mode Selection
        1. 7.3.4.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.4.2 Clock Locking
      5. 7.3.5  Adjustable Switching Frequency and Phase Shift
      6. 7.3.6  Dual Random Spread Spectrum (DRSS)
      7. 7.3.7  Internal LDO, VCC UVLO, and BIAS Input
      8. 7.3.8  Bootstrap Voltage (BST Pin)
      9. 7.3.9  Soft Start and Recovery From Dropout
      10. 7.3.10 Safety Features
        1. 7.3.10.1 Power-Good Monitor
        2. 7.3.10.2 Overcurrent and Short-Circuit Protection
        3. 7.3.10.3 Hiccup
        4. 7.3.10.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Example Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Choosing the Switching Frequency
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitors
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Setting the Output Voltage
        6. 8.2.2.6 Compensation Components
        7. 8.2.2.7 Feed-forward Capacitor (CFF)
        8. 8.2.2.8 Maximum Ambient Temperature
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Clock Locking

After a valid synchronization signal is detected, a clock locking procedure is initiated. After approximately 2048 pulses, the clock frequency abruptly changes to the frequency of the synchronization signal. While the frequency adjusts suddenly, phase is maintained so that the clock cycle lying between operation at the default and synchronization frequencies is of intermediate length. There are no very long or very short pulses. After frequency is adjusted, phase is adjusted over a few tens of cycles so that rising synchronization edges correspond to rising the SW node pulses. See Figure 7-5.

LM654B0-Q1 Synchronization
                    Process
At pulse 4, the synchronization signal is detected. After approximately pulse 2048, the synchronization signal is ready to synchronize and the frequency is adjusted using a glitch-free technique, then the phase is locked.
Figure 7-5 Synchronization Process