SNVSCD3 September   2024 LM70840 , LM70860 , LM70880

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Input Voltage Range (VIN)
      2. 6.3.2  High-Voltage Bias Supply Regulator (VCC, BIAS, VDDA)
      3. 6.3.3  Enable (EN)
      4. 6.3.4  Power-Good Monitor (PG)
      5. 6.3.5  Switching Frequency (RT)
      6. 6.3.6  Dual Random Spread Spectrum (DRSS)
      7. 6.3.7  Soft Start
      8. 6.3.8  Output Voltage Setpoint (FB)
      9. 6.3.9  Minimum Controllable On-Time
      10. 6.3.10 Error Amplifier and PWM Comparator (FB, EXTCOMP)
      11. 6.3.11 Slope Compensation
      12. 6.3.12 Shunt Current Sensing
      13. 6.3.13 Hiccup Mode Current Limiting
      14. 6.3.14 Device Configuration (CONFIG)
      15. 6.3.15 Single-Output Dual-Phase Operation
      16. 6.3.16 Pulse Frequency Modulation (PFM) / Synchronization
      17. 6.3.17 Thermal Shutdown (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Active Mode
      4. 6.4.4 Sleep Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Train Components
        1. 7.1.1.1 Buck Inductor
        2. 7.1.1.2 Output Capacitors
        3. 7.1.1.3 Input Capacitors
        4. 7.1.1.4 EMI Filter
      2. 7.1.2 Error Amplifier and Compensation
      3. 7.1.3 Maximum Ambient Temperature
        1. 7.1.3.1 Derating Curves
    2. 7.2 Typical Applications
      1. 7.2.1 Design 1 – High Efficiency, Wide Input, 400kHz Synchronous Buck Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Custom Design With Excel Quickstart Tool
          3. 7.2.1.2.3 Buck Inductor
          4. 7.2.1.2.4 Current-Sense Resistance
          5. 7.2.1.2.5 Output Capacitors
          6. 7.2.1.2.6 Input Capacitors
          7. 7.2.1.2.7 Frequency Set Resistor
          8. 7.2.1.2.8 Feedback Resistors
          9. 7.2.1.2.9 Compensation Components
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Design 2 – High Efficiency 48V to 12V 400kHz Synchronous Buck Regulator
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Design and Layout
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
        1. 8.2.1.1 PCB Layout Resources
        2. 8.2.1.2 Thermal Design Resources
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) LM708x0 UNIT
JESD 51-7 EVM
29 PINS 29 PINS
RθJA Junction-to-ambient thermal resistance 33.5(2) 18.6(3) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.6  (4) °C/W
RθJB Junction-to-board thermal resistance 11.7  (4) °C/W
ψJT Junction-to-top characterization parameter (Tcase-center) 11.5 7.2 °C/W
ψJT Junction-to-top characterization parameter (Tcase-max) – 0.8 °C/W
ψJB Junction-to-board characterization parameter 11.6 6.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The value of RΘJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated with a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For thermal design information please see the  Maximum Ambient Temperature section.
(3) Refer to the  EVM User's Guide for board layout and additional information. For thermal design information please see the  Maximum Ambient Temperature  section.
(4) Not applicable to an EVM.