SNLS233O April   2007  – July 2015 LMH0344

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Block Description
      2. 7.3.2 Mute Reference (MuteREF)
      3. 7.3.3 Carrier Detect (CD) and Mute
      4. 7.3.4 Input Interfacing
      5. 7.3.5 Output Interfacing
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Dos and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage 4 V
Input voltage (all inputs) −0.3 to VCC+0.3 V
Junction temperature 125 °C
Lead temperature  (soldering 4 seconds) 260 °C
Storage temperature −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±8000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
Machine model (MM) 400
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±8000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.

6.3 Recommended Operating Conditions

MIN TYP MAX UNIT
(VCC – VEE) Supply Voltage 3.135 3.3 3.465 V
Input Coupling Capacitance 1 µF
AEC Capacitor (Connected between AEC+ and AEC-) 1 µF
TA Operating Free Air Temperature −40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) LMH0344 UNIT
RUM (WQFN) NYA (CS-BGA)
16 PINS 25 BALL
RθJA Junction-to-ambient thermal resistance 40 58.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 4.5 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 DC Electrical Characteristics

over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1)(2).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCMIN Input Common-Mode Voltage 1.9 V
VSDI Input Voltage Swing (SDI, SDI) At LMH0344 input(3)(4) 720 800 950 mVP−P
VCMOUT Output Common-Mode Voltage (SDO, SDO) VCC – VSDO/2 V
VSDO Output Voltage Swing 100-Ω load, differential 750 mVP-P
MUTEREF MUTEREF DC Voltage (floating) 1.3 V
MUTEREF Range 0.6 V
CD Output Voltage Carrier not present 2.4 V
Carrier present 0.4 V
MUTE Input Voltage Min to mute outputs 2.0 V
Max to force outputs active 0.8 V
ICC Supply Current 85 100 mA

6.6 AC Electrical Characteristics

over Supply Voltage and Operating Temperature ranges, unless otherwise specified(2)(8)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BRMIN Minimum Input Data Rate (SDI, SDI) 143 Mbps
BRMax Maximum Input Data Rate (SDI, SDI) 2970 Mbps
TJRaw Jitter for Various Cable Lengths 270 Mbps, Belden 1694A,
0 to 400 meters(5)		 0.2 UI
270 Mbps, Belden 1694A,
0 to 400 meters(6)		 0.07
1.485 Gbps, Belden 1694A,
0 to 140 meters(5)		 0.25
1.485 Gbps, Belden 1694A,
0-140 meters(6)		 0.08
2.97 Gbps, Belden 1694A,
0 to 120 meters(5)		 0.3
2.97 Gbps, Belden 1694A,
0 to 120 meters(6)		 0.18
tr,tf Output Rise Time, Fall Time (SDO, SDO) 20% to 80%(3) 60 130 ps
TR_F_Delta Mismatch in Rise/Fall Time (SDO, SDO) See  (3) 2 15 ps
tOS Output Overshoot (SDO, SDO) See  (3) 1% 5%
ROUT Output Resistance (SDO, SDO) single-ended 50 Ω
RLIN Input Return Loss (SDI, SDI) 5 MHz
to 1.5 GHz(7)		 15 dB
1.5 GHz
to 3.0 GHz(7)		 10 dB
RIN Input Resistance (SDI, SDI) single-ended 1.3 kΩ
CIN Input Capacitance (SDI, SDI) single-ended 1 pF
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 Volts.
(2) Typical values are stated for VCC = +3.3 V and TA = +25°C.
(3) Specification is ensured by characterization.
(4) This specification is for 1m cable only.
(5) Based on characterization data over the full range of recommended operating conditions of the device. Jitter is measured in accordance with RP 184, RP 192, and the applicable serial data transmission standard: ST 424, ST 292, or ST 259.
(6) Measured with Pseudo Matrix Pathological test signal.
(7) Input return loss is dependent onboard design. The LMH0344 exceeds this specification on the SD344 evaluation board with a return loss network consisting of an 8.2-nH inductor in parallel with a 0.5-pF capacitor in parallel with the 75Ω series resistor on the input.
(8) Due to SMPTE naming convention, all SMPTE Engineering Documents will be numbered as a two-letter prefix and a number. Documents and references with the same root number and year are functionally identical; for example ST 424-2006 and SMPTE 424M-2006 refer to the same document.

6.7 Typical Characteristics

LMH0344 20199004-1.gif
Figure 1. Serial Data Output After Equalizing 120 m of Belden 1694A 2.97-Gbps PRBS10
LMH0344 20199005-1.gif
Figure 2. Serial Data Output After Equalizing 120 m of Belden 1694A 2.97-Gbps Pseudo Matrix Pathological