SNOSAQ2F July   2005  – August 2024 LMH6702QML-SP

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Quality Conformance Inspection
    4. 5.4 Electrical Characteristics: DC Parameters
    5. 5.5 Electrical Characteristics: AC Parameters
    6. 5.6 Electrical Characteristics: Drift Values Parameters
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Feedback Resistor
      2. 6.1.2 Harmonic Distortion
      3. 6.1.3 Capacitive Load Drive
      4. 6.1.4 DC Accuracy and Noise
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NAB|8
  • NAC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

LMH6702QML-SP NAB Package, 8-Pin CDIP (Top View)Figure 4-1 NAB Package, 8-Pin CDIP (Top View)
LMH6702QML-SP NAC Package, 10-Pin CLGA (Top View)Figure 4-2 NAC Package, 10-Pin CLGA (Top View)