SNOSA83I August   2003  – August 2014 LMH6723 , LMH6724

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±5V Electrical Characteristics
    6. 6.6 ±2.5V Electrical Characteristics
    7. 6.7 Typical Performance Characteristics
  7. 7 Application and Implementation
    1. 7.1  Application Information
    2. 7.2  Typical Application
    3. 7.3  Evaluation Boards
    4. 7.4  Feedback Resistor Selection
    5. 7.5  Active Filters
    6. 7.6  Driving Capacitive Loads
    7. 7.7  Inverting Input Parasitic Capacitance
    8. 7.8  Layout Considerations
    9. 7.9  Video Performance
    10. 7.10 Single 5-V Supply Video
      1. 7.10.1 Application Curves
  8. 8 Power Supply Recommendations
    1. 8.1 ESD Protection
  9. 9 Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (April 2013) to I Revision

  • Changed data sheet structure and organization. Added, updated, or renamed the following sections: Device Information Table, Application and Implementation; Power Supply Recommendations; Device and Documentation Support; Mechanical, Packaging, and Ordering Information. Removed "LMH6725" from title and document.Go
  • Deleted "Channel Matching" and "Crosstalk" plots. Go
  • Changed Figure 11Go
  • Changed Figure 12Go
  • Changed Figure 29Go
  • Changed Figure 30Go
  • Deleted sentence beginning "These evaluation boards..." Go
  • Deleted sentence beginning, "Although the example..." Go
  • Deleted sentence beginning "The SOIC-14 has ..." Go

Changes from G Revision (April 2013) to H Revision

  • Changed layout of National Data Sheet to TI formatGo