SNOSA87C October   2003  – October 2016 LMV116 , LMV118

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: 2.7 V
    6. 6.6 Electrical Characteristics: 5 V
    7. 6.7 Electrical Characteristics: ±5 V
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Quasi-Saturated State
      2. 7.4.2 Micro-Power Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application: 2.7-V Single Supply 2:1 MUX
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from B Revision (May 2013) to C Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Functional Block Diagram, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed RθJA from 265°C/W to 182.7°C/WGo

Changes from A Revision (May 2013) to B Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo