SNOSC69D April   2012  – March 2017 LMV611 , LMV612 , LMV614

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 1.8 V (DC)
    6. 6.6  Electrical Characteristics - 1.8 V (AC)
    7. 6.7  Electrical Characteristics - 2.7 V (DC)
    8. 6.8  Electrical Characteristics - 2.7 V (AC)
    9. 6.9  Electrical Characteristics - 5 V (DC)
    10. 6.10 Electrical Characteristics - 5 V (AC)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Bias Current Consideration
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Half-Wave Rectifier With Rail-to-Ground Output Swing
      2. 8.1.2 Instrumentation Amplifier With Rail-to-Rail Input and Output
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Current Sensing
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Supply Values: 1.8 V (Typical)
  • Ensured 1.8-V, 2.7-V, and 5-V Specifications
  • Output Swing:
    • 80 mV From Rail With 600-Ω Load
    • 30 mV From Rail With 2-kΩ Load
  • VCM = 200 mV Beyond Rails
  • 100-µA Supply Current (Per Channel)
  • 1.4-MHz Gain Bandwidth Product
  • Maximum VOS = 4 mV
  • Temperature Range: −40°C to +125°C
  • Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer

2 Applications

  • Consumer Communication
  • Consumer Computing
  • PDAs
  • Audio Pre-Amplifiers
  • Portable or Battery-Powered Electronic Equipment
  • Supply Current Monitoring
  • Battery Monitoring

Typical Application

LMV611 LMV612 LMV614 30185616.gif

3 Description

The LMV61x devices are single, dual, and quad low-voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends
200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-µA (typical) quiescent current.

The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.

The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LMV611 SOT-23 (5) 2.92 mm × 1.60 mm
SC70 (5) 2.00 mm × 1.25 mm
LMV612 VSSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 4.90 mm × 3.91 mm
LMV614 TSSOP (14) 5.00 mm × 4.40 mm
SOIC (14) 8.64 mm × 3.90 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.