Quad low voltage, low power, RRIO general purpose amplifier
Product details
Parameters
Package | Pins | Size
Features
- Supply Values: 1.8 V (Typical)
- Ensured 1.8-V, 2.7-V, and 5-V Specifications
- Output Swing:
- 80 mV From Rail With 600-Ω Load
- 30 mV From Rail With 2-kΩ Load
- VCM = 200 mV Beyond Rails
- 100-µA Supply Current (Per Channel)
- 1.4-MHz Gain Bandwidth Product
- Maximum VOS = 4 mV
- Temperature Range: −40°C to +125°C
- Create a Custom Design Using the LMV61x With the WEBENCH® Power Designer
All trademarks are the property of their respective owners.
Description
The LMV61x devices are single, dual, and quad low-voltage, low-power operational amplifiers (op amps). They are designed specifically for low-voltage, general-purpose applications. Other important product characteristics are, rail-to-rail input or output, low supply voltage of 1.8 V and wide temperature range. The LMV61x input common mode extends
200 mV beyond the supplies and the output can swing rail-to-rail unloaded and within 30 mV with 2-kΩ load at 1.8-V supply. The LMV61x achieves a gain bandwidth of 1.4 MHz while drawing 100-µA (typical) quiescent current.
The industrial-plus temperature range of −40°C to 125°C allows the LMV61x to accommodate a broad range of extended environment applications.
The LMV611 is offered in the tiny 5-pin SC70 package, the LMV612 in space-saving 8-pin VSSOP and SOIC packages, and the LMV614 in 14-pin TSSOP and SOIC packages. These small package amplifiers offer an ideal solution for applications requiring minimum PCB footprint. Applications with area constrained PCB requirements include portable and battery-operated electronics.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | LMV61x Single, Dual, and Quad, 1.4-MHz, Low-Power, General-Purpose 1.8-V Operational Amplifiers datasheet (Rev. D) | Mar. 29, 2017 |
Technical article | What is an op amp? | Jan. 21, 2020 | |
E-book | Analog Engineer’s Pocket Reference Guide Fifth Edition (Rev. C) | Nov. 30, 2018 | |
Technical article | How to lay out a PCB for high-performance, low-side current-sensing designs | Feb. 06, 2018 | |
Technical article | Low-side current sensing for high-performance cost-sensitive applications | Jan. 22, 2018 | |
Technical article | Voltage and current sensing in HEV/EV applications | Nov. 22, 2017 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | Mar. 28, 2017 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Features
- Expedites circuit design with analog-to-digital converters (ADCs) and digital-to-analog converters (DACs)
- Noise calculations
- Common unit translation
- Solves common amplifier circuit design problems
- Gain selections using standard resistors
- Filter configurations
- Total noise for common amplifier configurations
- (...)
Reference designs
Design files
-
download TIDA-00847 BOM Files.zip (437KB) -
download TIDA-00847 Assembly Files.zip (471KB) -
download TIDA-00847 Layer Plots.zip (3690KB) -
download TIDA-00847 Altium.zip (3475KB) -
download TIDA-00847 Gerber.zip (4730KB)
Design files
-
download TIDA-00661 BOM.zip (504KB) -
download TIDA-00661 Assembly Drawing .zip (625KB) -
download TIDA-00661 Layer Plots.zip (2825KB) -
download TIDA-00661 Altium.zip (9909KB) -
download TIDA-00661 Gerber.zip (660KB)
Design files
-
download TIDA-00809 BOM.zip (224KB) -
download TIDA-00809 Assembly Files.zip (291KB) -
download TIDA-00809 Layer Plots.zip (971KB) -
download TIDA-00809 Altium .zip (3252KB) -
download TIDA-00809 Gerber.zip (603KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 14 | View options |
TSSOP (PW) | 14 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.