SNVS723G October   2011  – July 2018 LMZ10500

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Efficiency at VIN = 3.6 V
      2.      Radiated EMI (CISPR22) VIN = 5 V, VOUT = 1.8 V, IOUT = 650 mA
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Start-up Behavior and Soft Start
      3. 7.3.3 Output Short Circuit Protection
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Circuit Operation
      2. 7.4.2 Input Undervoltage Detection
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 EN Pin Operation
      5. 7.4.5 Internal Synchronous Rectification
      6. 7.4.6 High Duty Cycle Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 RT and RB Selection for Fixed VOUT
          2. 8.2.2.2.2 Output Voltage Accuracy Optimization
        3. 8.2.2.3 Dynamic Output Voltage Scaling
        4. 8.2.2.4 Integrated Inductor
        5. 8.2.2.5 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
  9. Power Supply Recommendations
    1. 9.1 Voltage Range
    2. 9.2 Current Capability
    3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Package Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Package Considerations

Use the following recommendations when utilizing machine placement :

  • Use 1.06 mm (42 mil) or smaller nozzle size. The pickup area is the top of the inductor, which is 1.6 mm × 2 mm.
  • Soft tip pick and place nozzle is recommended.
  • Add 0.05 mm to the component thickness so that the device will be released 0.05 mm (2 mil) into the solder paste without putting pressure or splashing the solder paste.
  • Slow the pick arm when picking the part from the tape and reel carrier and when depositing the IC on the board.
  • If the machine releases the component by force, use minimum force or no more than 3 Newtons.

For manual placement:

  • Use a vacuum pick up hand tool with soft tip head.
  • If vacuum pick up tool is not available, use non-metal tweezers and hold the part by sides.
  • Use minimal force when picking and placing the module on the board.
  • Using hot air station provides better temperature control and better controlled air flow than a heat gun.
  • Go to the video section at www.ti.com/product/lmz10500 for a quick video on how to solder rework the LMZ10500.