SNVS872D August 2012 – August 2018 LMZ21700
In order to achieve a small solution size the LMZ21700 Nano Module comes in an innovative MicroSiP™ package. The construction consists of a synchronous buck converter IC embedded inside an FR-4 laminate substrate, with a power inductor mounted on top of the substrate material. See Figure 12 and Figure 13 below. The bottom (landing pads) of the package resemble a typical 8-pin DFN package. See the Mechanical drawings at the end of the datasheet for details on the recommended landing pattern and solder paste stencil information.