SBOSA28B August   2023  – August 2026 LOG200

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Speed, Logarithmic Current-to-Voltage Conversion
      2. 6.3.2 Voltage and Current References
      3. 6.3.3 Adaptive Photodiode Bias
      4. 6.3.4 Auxiliary Operational Amplifier
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Logarithmic Transfer Function
        1. 7.1.1.1 Logarithmic Conformity Error
        2. 7.1.1.2 Error Analysis Example
    2. 7.2 Typical Application
      1. 7.2.1 Optical Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) LOG200 UNIT
16 PINS
RGT (VQFN) YBH (DSBGA)
RθJA Junction-to-ambient thermal resistance 66.7 80.2 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 61.8 0.4 ℃/W
RθJB Junction-to-board thermal resistance 39.8 18.8 ℃/W
ψJT Junction-to-top characterization parameter 3.8 0.2 ℃/W
ψJB Junction-to-board characterization parameter 39.8 18.8 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 31.2 N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.