SNVS001F april   2000  – july 2023 LP2980-ADJ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
        1. 8.1.2.1 Recommended Capacitors for the New Chip
        2. 8.1.2.2 Recommended Capacitors for the Legacy Chip
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Feed-Forward Capacitor (CFF)
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting VOUT For the LP2980-ADJ LDO
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 Device Nomenclature

Table 9-1 Available Options(1)
PRODUCT VOUT
LP2980cxxxz-ADJ/NOPB

Legacy chip

 A is for higher accuracy and non-A is for standard grade.c is the accuracy specification.xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel.

LP2980Axxxz-ADJ/M3

New chip

 A is for higher accuracy and non-A is for standard grade.xxx is the package designator.z is the package quantity. X is for large quantity reel and non-X is for small quantity reel.
M3 is a suffix designator for newer chip redesigns, fabricated on the latest TI process technology.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.