SNOS773P March   2000  – February 2025 LP2981-N

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.1.1.1 Tantalum Capacitors
          2. 7.1.1.1.2 Ceramic Capacitors
          3. 7.1.1.1.3 Aluminum Capacitors
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input and Output Capacitor Requirements
        1. 7.1.2.1 Input Capacitor
        2. 7.1.2.2 Output Capacitor
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Third-Party Products Disclaimer
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Related Documentation
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Typical Characteristics

at TA = 25°C, VIN = VO(NOM) + 1V, COUT = 4.7μF, CIN = 1μF all voltage options, and ON/OFF pin tied to VIN (unless otherwise noted)

LP2981-N Output Voltage vs Temperature (Legacy Chip)
VIN = 6V, VOUT = 5V
Figure 5-1 Output Voltage vs Temperature (Legacy Chip)
LP2981-N Output Voltage vs Temperature (Legacy Chip)
VIN = 4.0V, VOUT = 3.0V
Figure 5-3 Output Voltage vs Temperature (Legacy Chip)
LP2981-N Output Voltage vs VIN (Legacy Chip)
VOUT = 5.0V
Figure 5-5 Output Voltage vs VIN (Legacy Chip)
LP2981-N Output Voltage vs VIN (Legacy Chip)
VOUT = 3.0V
Figure 5-7 Output Voltage vs VIN (Legacy Chip)
LP2981-N Output Voltage vs VIN and Temperature (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-9 Output Voltage vs VIN and Temperature (New Chip)
LP2981-N Dropout Voltage (VDO) vs Temperature (Legacy Chip)
 
Figure 5-11 Dropout Voltage (VDO) vs Temperature (Legacy Chip)
LP2981-N Dropout Voltage (VDO) vs Load Current (Legacy Chip)
 
Figure 5-13 Dropout Voltage (VDO) vs Load Current (Legacy Chip)
LP2981-N Ground Pin Current (IGND) vs Temperature (Legacy Chip)
 
Figure 5-15 Ground Pin Current (IGND) vs Temperature (Legacy Chip)
LP2981-N Ground Pin Current (IGND) vs Load Current (Legacy Chip)
 
Figure 5-17 Ground Pin Current (IGND) vs Load Current (Legacy Chip)
LP2981-N Input Current vs Input Voltage (VIN) (Legacy Chip)
VOUT = 5V, RL = ∞ and RL = 5kΩ
Figure 5-19 Input Current vs Input Voltage (VIN) (Legacy Chip)
LP2981-N Input Current vs Input Voltage (VIN) (New Chip)
VOUT = 3.3V, RL = 3.3kΩ
Figure 5-21 Input Current vs Input Voltage (VIN) (New Chip)
LP2981-N Line Transient Response (New Chip)
VOUT = 3.3V, IL = 100mA
Figure 5-23 Line Transient Response (New Chip)
LP2981-N Line Transient Response (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-25 Line Transient Response (New Chip)
LP2981-N Load Transient Response (Legacy Chip)
VOUT = 3.0V, COUT = 10μF
Figure 5-27 Load Transient Response (Legacy Chip)
LP2981-N Load Transient Response (Legacy Chip)
VOUT = 5.0V, COUT = 10μF
Figure 5-29 Load Transient Response (Legacy Chip)
LP2981-N Short-Circuit Current vs Time (Legacy Chip)
VIN = 6.0V
Figure 5-31 Short-Circuit Current vs Time (Legacy Chip)
LP2981-N Short-Circuit Current vs Time (Legacy Chip)
VIN = 16.0V
Figure 5-33 Short-Circuit Current vs Time (Legacy Chip)
LP2981-N Instantaneous Short-Circuit Current vs Temperature (Legacy Chip)
 
Figure 5-35 Instantaneous Short-Circuit Current vs Temperature (Legacy Chip)
LP2981-N Short-Circuit Current vs Output Voltage (VOUT) (Legacy Chip)
VIN = 6.0V
Figure 5-37 Short-Circuit Current vs Output Voltage (VOUT) (Legacy Chip)
LP2981-N Output Impedance vs Frequency (Legacy Chip)
VOUT = 3.0V
Figure 5-39 Output Impedance vs Frequency (Legacy Chip)
LP2981-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-41 Ripple Rejection vs Frequency (Legacy Chip)
LP2981-N Ripple Rejection vs Output Capacitor (CL) and Frequency (New Chip)
 
Figure 5-43 Ripple Rejection vs Output Capacitor (CL) and Frequency (New Chip)
LP2981-N Output Noise Density vs Load Current (IL) Frequency (New Chip)
 
Figure 5-45 Output Noise Density vs Load Current (IL) Frequency (New Chip)
LP2981-N Input-to-Output Leakage vs Temperature (Legacy Chip)
 
Figure 5-47 Input-to-Output Leakage vs Temperature (Legacy Chip)
LP2981-N Output Reverse Leakage vs Temperature (New Chip)
 
Figure 5-49 Output Reverse Leakage vs Temperature (New Chip)
LP2981-N Turn-On Waveform (New Chip)
VOUT = 3.3V, RL = 3.3kΩ
Figure 5-51 Turn-On Waveform (New Chip)
LP2981-N Turn-Off Waveform (New Chip)
VOUT = 5V, RL = 5kΩ
Figure 5-53 Turn-Off Waveform (New Chip)
LP2981-N ON/OFF Pin Current vs VON/OFF (New Chip)
VIN = 4.3V
Figure 5-55 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2981-N ON/OFF Threshold vs Temperature (Legacy Chip)
 
Figure 5-57 ON/OFF Threshold vs Temperature (Legacy Chip)
LP2981-N Output Voltage vs Temperature (Legacy Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-2 Output Voltage vs Temperature (Legacy Chip)
LP2981-N Output Voltage vs Temperature (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-4 Output Voltage vs Temperature (New Chip)
LP2981-N Output Voltage vs VIN (Legacy Chip)
VOUT = 3.3V
Figure 5-6 Output Voltage vs VIN (Legacy Chip)
LP2981-N Output Voltage vs VIN (New Chip)
VOUT = 3.3V
Figure 5-8 Output Voltage vs VIN (New Chip)
LP2981-N Line Regulation vs VIN and Temperature (New Chip)
VOUT = 3.3V, IL = 1mA
Figure 5-10 Line Regulation vs VIN and Temperature (New Chip)
LP2981-N Dropout Voltage (VDO) vs Temperature (New Chip)
 
Figure 5-12 Dropout Voltage (VDO) vs Temperature (New Chip)
LP2981-N Dropout Voltage (VDO) vs Load Current (New Chip)
 
Figure 5-14 Dropout Voltage (VDO) vs Load Current (New Chip)
LP2981-N Ground Pin Current (IGND) vs Temperature (New Chip)
 
Figure 5-16 Ground Pin Current (IGND) vs Temperature (New Chip)
LP2981-N Ground Pin Current (IGND) vs Load Current (New Chip)
 
Figure 5-18 Ground Pin Current (IGND) vs Load Current (New Chip)
LP2981-N Input Current vs Input Voltage (VIN) (Legacy Chip)
VOUT = 5V, RL = 500Ω and RL = 50Ω
Figure 5-20 Input Current vs Input Voltage (VIN) (Legacy Chip)
LP2981-N Line Transient Response (Legacy Chip)
VOUT = 5V, IL = 100mA
Figure 5-22 Line Transient Response (Legacy Chip)
LP2981-N Line Transient Response (Legacy Chip)
VOUT = 5V, IL = 1mA
Figure 5-24 Line Transient Response (Legacy Chip)
LP2981-N Load Transient Response (Legacy Chip)
VOUT = 3.0V, COUT = 3.3μF
Figure 5-26 Load Transient Response (Legacy Chip)
LP2981-N Load Transient Response (Legacy Chip)
VOUT = 5.0V, COUT = 3.3μF
Figure 5-28 Load Transient Response (Legacy Chip)
LP2981-N Load Transient Response (New Chip)
VOUT = 3.3V, COUT = 2.2μF
Figure 5-30 Load Transient Response (New Chip)
LP2981-N Short-Circuit Current vs Time (New Chip)
VIN = 6.0V
Figure 5-32 Short-Circuit Current vs Time (New Chip)
LP2981-N Short-Circuit Current vs Time (New Chip)
VIN = 16.0V
Figure 5-34 Short-Circuit Current vs Time (New Chip)
LP2981-N Instantaneous Short-Circuit Current vs Temperature (New Chip)
 
Figure 5-36 Instantaneous Short-Circuit Current vs Temperature (New Chip)
LP2981-N Short-Circuit Current vs Output Voltage (VOUT) (New Chip)
 
Figure 5-38 Short-Circuit Current vs Output Voltage (VOUT) (New Chip)
LP2981-N Output Impedance vs Frequency (Legacy Chip)
VOUT = 3.0V
Figure 5-40 Output Impedance vs Frequency (Legacy Chip)
LP2981-N Ripple Rejection vs Load Current (IL) and Frequency (New Chip)
 
Figure 5-42 Ripple Rejection vs Load Current (IL) and Frequency (New Chip)
LP2981-N Output Noise Density vs Frequency (Legacy Chip)
 
Figure 5-44 Output Noise Density vs Frequency (Legacy Chip)
LP2981-N Output Noise Density vs Output Capacitor (CL) Frequency (New Chip)
 
Figure 5-46 Output Noise Density vs Output Capacitor (CL) Frequency (New Chip)
LP2981-N Output Reverse Leakage vs Temperature (Legacy Chip)
 
Figure 5-48 Output Reverse Leakage vs Temperature (Legacy Chip)
LP2981-N Turn-On Waveform (Legacy Chip)
VOUT = 5V, RL = 5kΩ
Figure 5-50 Turn-On Waveform (Legacy Chip)
LP2981-N Turn-Off Waveform (Legacy Chip)
VOUT = 5V, RL = 5kΩ
Figure 5-52 Turn-Off Waveform (Legacy Chip)
LP2981-N ON/OFF Pin Current vs VON/OFF (Legacy Chip)
 
Figure 5-54 ON/OFF Pin Current vs VON/OFF (Legacy Chip)
LP2981-N ON/OFF Pin Current vs VON/OFF (New Chip)
VIN = 16.0V
Figure 5-56 ON/OFF Pin Current vs VON/OFF (New Chip)
LP2981-N ON/OFF Threshold vs Temperature (New Chip)
 
Figure 5-58 ON/OFF Threshold vs Temperature (New Chip)