SNVS170D October   2001  – April 2016 LP2983

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Accuracy Output Voltage
      2. 7.3.2 Low Ground Current
      3. 7.3.3 Reverse Input-Output Voltage
      4. 7.3.4 ON/OFF Input Operation
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VO(NOM) + 1 V ≤ VIN < 16 V
      2. 7.4.2 Operation With ON/OFF Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Input Capacitor
          2. 8.2.2.1.2 Output Capacitors
        2. 8.2.2.2 Capacitor Characteristics
        3. 8.2.2.3 Power Dissipation
        4. 8.2.2.4 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (April 2013) to D Revision

  • Added Pin Configuration and Functions section, ESD Ratings table and Thermal Information table with update thermal values, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; change pin names VOUT and VIN to OUT and IN Go
  • Changed footnote 3 to Abs Max to replace out-of-date thetaJA temperature with general informationGo
  • Added Thermal Information table Go

Changes from B Revision (April 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo