SNVS018AA march   2000  – july 2023 LP2985-N

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 8.1.4 Reverse Current
      5. 8.1.5 Power Dissipation (PD)
      6. 8.1.6 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Characteristics
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Device Nomenclature
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • VIN range: 2.5 V to 16 V
  • VOUT range (new chip):
    • 1.2 V to 5.0 V (fixed, 100-mV steps)
  • VOUT range (legacy chip): 2.5 V to 6.1 V
  • VOUT accuracy:
    • ±1% for A-grade legacy chip
    • ±1.5% for standard-grade legacy chip
    • ±0.5% for new chip only
  • Output accuracy over load, and temperature:
    • ±1% for new chip
  • Output current: Up to 150 mA
  • Low IQ (new chip): 71 μA at ILOAD = 0 mA
  • Low IQ (new chip): 750 μA at ILOAD = 150 mA
  • Shutdown current:
    • 0.05 μA (typ) for legacy chip
    • 1.12 μA (typ) for new chip
  • Low noise: 30 μVRMS with 10-nF bypass capacitor
  • Output current limiting and thermal protection
  • Stable with 2.2-µF ceramic capacitors
  • High PSRR: 70 dB at 1 kHz, 40 dB at 1 MHz
  • Operating junction temperature: –40°C to +125°C
  • Package: 5-pin SOT-23 (DBV) ultra-low dropout voltage