SNVS321O January   2005  – December 2015 LP38691 , LP38691-Q1 , LP38693 , LP38693-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LP38691 and LP38693
    3. 6.3 ESD Ratings: LP38691-Q1 and LP38693-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Overload Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Voltage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 No-Load Stability
        6. 8.2.2.6 Capacitor Characteristics
        7. 8.2.2.7 RFI/EMI Susceptibility
        8. 8.2.2.8 Output Noise
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

NDP Package
3-Pin TO-252
Top View
LP38691 LP38693 LP38691-Q1 LP38693-Q1 20126503.gif
NDC Package
5-Pin SOT-223
Top View
LP38691 LP38693 LP38691-Q1 LP38693-Q1 20126504.gif
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38691SD Top View
LP38691 LP38693 LP38691-Q1 LP38693-Q1 20126505.gif
NC - No internal connection
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38693SD Top View
LP38691 LP38693 LP38691-Q1 LP38693-Q1 20126506.gif

Pin Functions

PIN I/O DESCRIPTION
NAME TO-252 WSON SOT-223
DAP — √ √ — — WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane. See WSON Mounting section for more information.
EN — — 3 1 I The EN pin allows the part to be turned ON and OFF by pulling this pin high or low.
GND TAB 2 2 5 — Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is thermally connected to the die and functions as a heat sink when the soldered down to a large copper plane.
IN 3 1, 6 1, 6 4 I This is the input supply voltage to the regulator. For WSON devices, both IN pins must be tied together for full current operation (250 mA maximum per pin).
OUT 1 4 4 3 O Regulated output voltage
SNS — 5 5 — I WSON Only - Output SNS pin allows remote sensing at the load which eliminate the error in output voltage due to voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be tied to OUT.