SNVSCQ1A March   2025  – August 2025 LP5816

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Sloper
      4. 7.3.4 Protections
        1. 7.3.4.1 UVLO
        2. 7.3.4.2 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Initialization Mode
      2. 7.4.2 Standby and Normal Mode
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 Thermal Shutdown Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Data Tansactions
      2. 7.5.2 I2C Data Format
      3. 7.5.3 Command Description
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
        2. 8.2.3.2 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.4.2 Thermal Shutdown

The LP5816 implements a thermal shutdown mechanism to protect the device from damage due to overheating. When the junction temperature of the device rises to 155oC (typical), the device turns off all output channels. The TSD flag is set to indicate thermal shutdown is triggered. The LP5816 releases thermal shutdown when the junction temperature reduces to 140oC (typical). The TSD flag needs manual clear by setting TSD_CLR bit when CHIP_EN = 1.