SNVSA34E September   2014  – December 2019 LP5907-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitors
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LP5907-Q1 Voltage Options
      2. 7.3.2 Enable (EN)
      3. 7.3.3 Low Output Noise
      4. 7.3.4 Output Automatic Discharge
      5. 7.3.5 Remote Output Capacitor Placement
      6. 7.3.6 Thermal Overload Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Capacitor Characteristics
        6. 8.2.2.6 Remote Capacitor Operation
        7. 8.2.2.7 No-Load Stability
        8. 8.2.2.8 Enable Control
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LP5907-Q1 UNIT
DBV (SOT-23) DQN (X2SON-4)
5 PINS 4-PINS
RθJA Junction-to-ambient thermal resistance 186.9 197.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 112.3 139.4 °C/W
RθJB Junction-to-board thermal resistance 52.3 130.2 °C/W
ψJT Junction-to-top characterization parameter 27.5 6.4 °C/W
ψJB Junction-to-board characterization parameter 51.8 130.2 °C/W
RθJC(top) Junction-to-case (bottom) thermal resistance — 139.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.