SNVSAA8C December   2015  – September 2016 LP5912-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Voltage Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Output and Input Capacitors
  8. Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable (EN)
      2. 9.3.2 Output Automatic Discharge (RAD)
      3. 9.3.3 Reverse Current Protection (IRO)
      4. 9.3.4 Internal Current Limit (ISC)
      5. 9.3.5 Thermal Overload Protection (TSD)
      6. 9.3.6 Power-Good Output (PG)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable (EN)
      2. 9.4.2 Minimum Operating Input Voltage (VIN)
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 External Capacitors
        2. 10.2.2.2 Input Capacitor
        3. 10.2.2.3 Output Capacitor
        4. 10.2.2.4 Capacitor Characteristics
        5. 10.2.2.5 Remote Capacitor Operation
        6. 10.2.2.6 Power Dissipation
        7. 10.2.2.7 Estimating Junction Temperature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DRV Package
6-Pin WSON With Thermal Pad
Top View
LP5912-Q1 pinout_snvsa77.gif

Pin Functions

PIN I/O DESCRIPTION
NUMBER NAME
1 OUT O Regulated output voltage
2 NC No internal connection. Leave open, or connect to ground.
3 PG O Power-good indicator. Requires external pullup.
4 EN I Enable input. Logic high = device is ON, logic low = device is OFF, with internal 3-MΩ pulldown.
5 GND G Ground
6 IN I Unregulated input voltage
Exposed thermal pad Connect to copper area under the package to improve thermal performance. The use of thermal vias to transfer heat to inner layers of the PCB is recommended. Connect the thermal pad to ground, or leave floating. Do not connect the thermal pad to any potential other than ground.