SLLS723D April   2006  – February 2024 MAX232E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics: Driver
    7. 5.7  Electrical Characteristics: Receiver
    8. 5.8  Switching Characteristics: Driver
    9. 5.9  Switching Characteristics: Receiver
    10. 5.10 Typical Characteristics
  7.   17
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power
      2. 6.3.2 RS-232 Driver
      3. 6.3.3 RS-232 Receiver
    4. 6.4 Device Functional Modes
      1. 6.4.1 VCC Powered by 5V
      2. 6.4.2 VCC Unpowered
      3. 6.4.3 Truth Tables
  9. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times. Make the impedance from MAX232E ground pin and circuit board ground plane as low as possible for best ESD performance. Use wide metal and multiple vias on both sides of ground pin.