SLAS677G September 2010 – May 2020 MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310
PRODUCTION DATA.
The following documents describe the MSP430F5310 and MSP430F530x devices. Copies of these documents are available on the Internet at www.ti.com.
Receiving Notification of Document Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com (for links to the product folders, see Table 7-2). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.
Errata
Describes the known exceptions to the functional specifications for the MSP430F5310 device.
Describes the known exceptions to the functional specifications for the MSP430F5309 device.
Describes the known exceptions to the functional specifications for the MSP430F5308 device.
Describes the known exceptions to the functional specifications for the MSP430F5304 device.
User's Guides
Detailed information on the modules and peripherals available in this device family.
The MSP430 bootloader (BSL) lets users communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.
This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.
Application Reports
Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.
System-level ESD has become increasingly demanding as silicon technology scales to lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses three ESD topics to help board designers and OEMs understand and design robust system-level designs: (1) Component-level ESD testing and system-level ESD testing; (2) General design guidelines for system-level ESD protection; (3) Introduction to System Efficient ESD Design (SEED), a co-design methodology of on-board and on-chip ESD protection. A few real-world system-level ESD protection design examples and their results are discussed.