SLASEE5D January   2018  – January 2021 MSP430FR2422

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Pin Attributes
    3. 7.3 Signal Descriptions
    4. 7.4 Pin Multiplexing
    5. 7.5 Buffer Types
    6. 7.6 Connection of Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode (LPM0) Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics - Low-Power Mode Supply Currents
    10. 8.10 Typical Characteristics – Current Consumption Per Module
    11. 8.11 Thermal Resistance Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 DCO Frequency
        4. 8.12.3.4 REFO
        5. 8.12.3.5 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. 8.12.3.6 Module Oscillator (MODOSC)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Typical Characteristics – Outputs at 3 V and 2 V
      5. 8.12.5  VREF+ Built-in Reference
        1. 8.12.5.1 VREF+
      6. 8.12.6  Timer_A
        1. 8.12.6.1 Timer_A
      7. 8.12.7  eUSCI
        1. 8.12.7.1 eUSCI (UART Mode) Clock Frequency
        2. 8.12.7.2 eUSCI (UART Mode)
        3. 8.12.7.3 eUSCI (SPI Master Mode) Clock Frequency
        4. 8.12.7.4 eUSCI (SPI Master Mode)
        5. 8.12.7.5 eUSCI (SPI Slave Mode)
        6. 8.12.7.6 eUSCI (I2C Mode)
      8. 8.12.8  ADC
        1. 8.12.8.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.8.2 ADC, 10-Bit Timing Parameters
        3. 8.12.8.3 ADC, 10-Bit Linearity Parameters
      9. 8.12.9  FRAM
        1. 8.12.9.1 FRAM
      10. 8.12.10 Debug and Emulation
        1. 8.12.10.1 JTAG, Spy-Bi-Wire Interface
        2. 8.12.10.2 JTAG, 4-Wire Interface
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  CPU
    3. 9.3  Operating Modes
    4. 9.4  Interrupt Vector Addresses
    5. 9.5  Bootloader (BSL)
    6. 9.6  JTAG Standard Interface
    7. 9.7  Spy-Bi-Wire Interface (SBW)
    8. 9.8  FRAM
    9. 9.9  Memory Protection
    10. 9.10 Peripherals
      1. 9.10.1  Power-Management Module (PMM)
      2. 9.10.2  Clock System (CS) and Clock Distribution
      3. 9.10.3  General-Purpose Input/Output Port (I/O)
      4. 9.10.4  Watchdog Timer (WDT)
      5. 9.10.5  System (SYS) Module
      6. 9.10.6  Cyclic Redundancy Check (CRC)
      7. 9.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.10.8  Timers (Timer0_A3, Timer1_A3)
      9. 9.10.9  Hardware Multiplier (MPY)
      10. 9.10.10 Backup Memory (BAKMEM)
      11. 9.10.11 Real-Time Clock (RTC)
      12. 9.10.12 10-Bit Analog-to-Digital Converter (ADC)
      13. 9.10.13 Embedded Emulation Module (EEM)
    11. 9.11 Input/Output Diagrams
      1. 9.11.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 9.11.2 Port P2 (P2.0 to P2.6) Input/Output With Schmitt Trigger
    12. 9.12 Device Descriptors
    13. 9.13 Memory
      1. 9.13.1 Memory Organization
      2. 9.13.2 Peripheral File Map
    14. 9.14 Identification
      1. 9.14.1 Revision Identification
      2. 9.14.2 Device Identification
      3. 9.14.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • RHL|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Attributes

Table 7-1 lists the attributes of all pins.

Table 7-1 Pin Attributes
PIN NUMBER SIGNAL NAME(1)(4) SIGNAL TYPE(2) BUFFER TYPE(3) POWER SOURCE(5) RESET STATE AFTER BOR(6)
RHL PW16
1 1 P1.1 (RD) I/O LVCMOS DVCC OFF
UCB0CLK I/O LVCMOS DVCC
ACLK I/O LVCMOS DVCC
A1 I Analog DVCC
VREF+ I Analog Power
2 2 P1.0 (RD) I/O LVCMOS DVCC OFF
UCB0STE I/O LVCMOS DVCC
A0 I Analog DVCC
Veref+ I Analog Power
3 3 TEST (RD) I LVCMOS DVCC OFF
SBWTCK I LVCMOS DVCC
4 4 RST (RD) I LVCMOS DVCC OFF
NMI I LVCMOS DVCC
SBWTDIO I/O LVCMOS DVCC
5 5 DVCC P Power DVCC N/A
6 6 DVSS P Power DVCC N/A
7 7 P2.1 (RD) I/O LVCMOS DVCC OFF
UCA0RXD I LVCMOS DVCC
UCA0SOMI I/O LVCMOS DVCC
XIN I LVCMOS DVCC
8 8 P2.0 (RD) I/O LVCMOS DVCC OFF
UCA0TXD O LVCMOS DVCC
UCA0SIMO I/O LVCMOS DVCC
XOUT O LVCMOS DVCC
9 P2.6 (RD) I/O LVCMOS DVCC OFF
UCB0SOMI I/O LVCMOS DVCC
UCB0SCL I/O LVCMOS DVCC
10 P2.5 (RD) I/O LVCMOS DVCC OFF
UCB0SIMO I/O LVCMOS DVCC
UCB0SDA I/O LVCMOS DVCC
A7 I Analog DVCC
11 P2.4 (RD) I/O LVCMOS DVCC OFF
TA1CLK I LVCMOS DVCC
UCB0CLK I/O LVCMOS DVCC
A6 I Analog DVCC
12 P2.3 (RD) I/O LVCMOS DVCC OFF
TA1.2 I/O LVCMOS DVCC
UCB0STE I/O LVCMOS DVCC
A5 I Analog DVCC
13 9 P2.2 (RD) I/O LVCMOS DVCC OFF
TA1.1 I/O LVCMOS DVCC
A4 I Analog DVCC
14 10 P1.7 (RD) I/O LVCMOS DVCC OFF
UCA0STE I/O LVCMOS DVCC
TDO O LVCMOS DVCC
15 11 P1.6 (RD) I/O LVCMOS DVCC OFF
UCA0CLK I/O LVCMOS DVCC
TA0CLK I LVCMOS DVCC
TDI I LVCMOS DVCC
TCLK I LVCMOS DVCC
16 12 P1.5 (RD) I/O LVCMOS DVCC OFF
UCA0RXD I LVCMOS DVCC
UCA0SOMI I/O LVCMOS DVCC
TA0.2 I/O LVCMOS DVCC
TMS I LVCMOS DVCC
17 13 P1.4 (RD) I/O LVCMOS DVCC OFF
UCA0TXD O LVCMOS DVCC
UCA0SIMO I/O LVCMOS DVCC
TA0.1 I/O LVCMOS DVCC
TCK I LVCMOS DVCC
18 14 DNC
19 15 P1.3 (RD) I/O LVCMOS DVCC OFF
UCB0SOMI I/O LVCMOS DVCC
UCB0SCL I/O LVCMOS DVCC
MCLK O LVCMOS DVCC
A3 I Analog DVCC
20 16 P1.2 (RD) I/O LVCMOS DVCC OFF
UCB0SIMO I/O LVCMOS DVCC
UCB0SDA I/O LVCMOS DVCC
SMCLK O LVCMOS DVCC
A2 I Analog DVCC
Veref- I Analog Power
Signals names with (RD) denote the reset default pin name.
Signal Types: I = Input, O = Output, I/O = Input or Output
Buffer Types: LVCMOS, Analog, or Power (see Table 7-3)
To determine the pin mux encodings for each pin, see Section 9.11.
The power source shown in this table is the I/O power source, which may differ from the module power source.
Reset States:
OFF = High-impedance with Schmitt trigger and pullup or pulldown (if available) disabled
N/A = Not applicable