SLASEO5C March   2019  – February 2020 MSP430FR2672 , MSP430FR2673 , MSP430FR2675 , MSP430FR2676

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1       Absolute Maximum Ratings
    2. 5.2       ESD Ratings
    3. 5.3       Recommended Operating Conditions
    4. 5.4       Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5       Active Mode Supply Current Per MHz
    6. 5.6       Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 5.7       Low-Power Mode (LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8       Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 5.9       Typical Characteristics – Low-Power Mode Supply Currents
    10. Table 5-1 Typical Characteristics – Current Consumption Per Module
    11. 5.10      Thermal Resistance Characteristics
    12. 5.11      Timing and Switching Characteristics
      1. 5.11.1  Power Supply Sequencing
        1. Table 5-2 PMM, SVS and BOR
      2. 5.11.2  Reset Timing
        1. Table 5-3 Wake-up Times From Low-Power Modes and Reset
      3. 5.11.3  Clock Specifications
        1. Table 5-4 XT1 Crystal Oscillator (Low Frequency)
        2. Table 5-5 DCO FLL, Frequency
        3. Table 5-6 DCO Frequency
        4. Table 5-7 REFO
        5. Table 5-8 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        6. Table 5-9 Module Oscillator (MODOSC)
      4. 5.11.4  Digital I/Os
        1. Table 5-10 Digital Inputs
        2. Table 5-11 Digital Outputs
        3. 5.11.4.1   Typical Characteristics – Outputs at 3 V and 2 V
      5. 5.11.5  Internal Shared Reference
        1. Table 5-12 Internal Shared Reference
      6. 5.11.6  Timer_A and Timer_B
        1. Table 5-13 Timer_A
        2. Table 5-14 Timer_B
      7. 5.11.7  eUSCI
        1. Table 5-15 eUSCI (UART Mode) Clock Frequency
        2. Table 5-16 eUSCI (UART Mode)
        3. Table 5-17 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-18 eUSCI (SPI Master Mode)
        5. Table 5-19 eUSCI (SPI Slave Mode)
        6. Table 5-20 eUSCI (I2C Mode)
      8. 5.11.8  ADC
        1. Table 5-21 ADC, Power Supply and Input Range Conditions
        2. Table 5-22 ADC, Timing Parameters
        3. Table 5-23 ADC, Linearity Parameters
      9. 5.11.9  Enhanced Comparator (eCOMP)
        1. Table 5-24 eCOMP0
      10. 5.11.10 CapTIvate
        1. Table 5-25 CapTIvate Electrical Characteristics
        2. Table 5-26 CapTIvate Signal-to-Noise Ratio Characteristics
      11. 5.11.11 FRAM
        1. Table 5-27 FRAM
      12. 5.11.12 Debug and Emulation
        1. Table 5-28 JTAG, 4-Wire and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Standard Interface
    7. 6.7  Spy-Bi-Wire Interface (SBW)
    8. 6.8  FRAM
    9. 6.9  Memory Protection
    10. 6.10 Peripherals
      1. 6.10.1  Power-Management Module (PMM)
      2. 6.10.2  Clock System (CS) and Clock Distribution
      3. 6.10.3  General-Purpose Input/Output Port (I/O)
      4. 6.10.4  Watchdog Timer (WDT)
      5. 6.10.5  System (SYS) Module
      6. 6.10.6  Cyclic Redundancy Check (CRC)
      7. 6.10.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 6.10.8  Timers (TA0, TA1, TA2, TA3 and TB0)
      9. 6.10.9  Hardware Multiplier (MPY)
      10. 6.10.10 Backup Memory (BAKMEM)
      11. 6.10.11 Real-Time Clock (RTC)
      12. 6.10.12 12-Bit Analog-to-Digital Converter (ADC)
      13. 6.10.13 eCOMP0
      14. 6.10.14 CapTIvate Technology
      15. 6.10.15 Embedded Emulation Module (EEM)
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.11.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.11.3 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      4. 6.11.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.11.5 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      6. 6.11.6 Port P6 (P6.0 to P6.2) Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptors
    13. 6.13 Memory
      1. 6.13.1 Memory Organization
      2. 6.13.2 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Revision Identification
      2. 6.14.2 Device Identification
      3. 6.14.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Layout Guidelines
      2. 7.2.2 CapTIvate Peripheral
        1. 7.2.2.1 Device Connection and Layout Fundamentals
        2. 7.2.2.2 Measurements
          1. 7.2.2.2.1 SNR
          2. 7.2.2.2.2 Sensitivity
          3. 7.2.2.2.3 Power
    3. 7.3 CapTIvate Technology Evaluation
  8. 8Device and Documentation Support
    1. 8.1  Getting Started and Next Steps
    2. 8.2  Device Nomenclature
    3. 8.3  Tools and Software
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Support Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Table 5-25 CapTIvate Electrical Characteristics

over operating free-air temperature range,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREG Reference voltage output ILOAD = 1.5 µA to 2 mA, after trim 1.5 1.55 1.6 V
CREG External buffer capacitor ESR ≤ 200 mΩ 0.8 1 1.2 µF
CELECTRODE Total capacitance of all external electrodes on all CapTIvate blocks Running a conversion at 4 MHz 300 pF
tWAKEUP,COLD Voltage regulator wake-up time LDO off and then turned on 700 µs
tWAKEUP,WARM Voltage regulator wake-up time  LDO in low-power mode and then turned on 260 µs
fCAPCLK CapTIvate oscillator frequency, nominal TA = 25ºC,
CAPCLK0.FREQSHFT = 00b
16 MHz
DCCAPCLK CapTIvate oscillator duty cycle Excluding first clock cycle, DC = thigh × f 40% 50% 60%
CapTIvate I/O voltage range allowed Use internal regulator for sensing (VREGSEL = 00b) -0.3 VREG V
Use DVCC for sensing (VREGSEL = 01b) -0.3 DVCC
DVCC range allowed Capacitive sensing using internal LDO (VREGSEL = 00b) 1.8 3.6 V
Capacitive sensing using DVCC (VREGSEL = 01b) 2.7 3.6
DVCC Cp:Cm ratio Ratio of RX parasitic capacitance (Cp) to RX-TX mutual capacitance (Cm)(1) CapTIvate module in mutual capacitance measurement mode 10:1 100:1 ratio
The ratio of the parasitic RX-GND capacitance Cp to the mutual RX-TX capacitance Cm must be larger than the minimum specified value to prevent an over voltage condition on the RX pin. This parameter only applied in mutual capacitance mode.

Table 5-26 lists the signal-to-noise ratio of the CapTIvate module.