SLAS797C August 2014 – August 2018 MSP430FR6927 , MSP430FR69271 , MSP430FR6928 , MSP430FR6977 , MSP430FR6979 , MSP430FR69791
TI recommends connecting a combination of a 1-µF plus a 100-nF low-ESR ceramic decoupling capacitor to each AVCC and DVCC pin. Higher-value capacitors may be used but can impact supply rail ramp-up time. Decoupling capacitors must be placed as close as possible to the pins that they decouple (within a few millimeters). Additionally, TI recommends separated grounds with a single-point connection for better noise isolation from digital to analog circuits on the board and to achieve high analog accuracy.