SLAS734G April   2011  – April 2016 MSP430G2203 , MSP430G2233 , MSP430G2303 , MSP430G2333 , MSP430G2403 , MSP430G2433 , MSP430G2533

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Current (Into VCC)
    6. 5.6  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    7. 5.7  Typical Characteristics, Low-Power Mode Supply Currents
    8. 5.8  Thermal Resistance Characteristics
    9. 5.9  Schmitt-Trigger Inputs, Ports Px
    10. 5.10 Leakage Current, Ports Px
    11. 5.11 Outputs, Ports Px
    12. 5.12 Output Frequency, Ports Px
    13. 5.13 Typical Characteristics - Outputs
    14. 5.14 Pin-Oscillator Frequency - Ports Px
    15. 5.15 Typical Characteristics - Pin-Oscillator Frequency
    16. 5.16 POR, BOR
    17. 5.17 Main DCO Characteristics
    18. 5.18 DCO Frequency
    19. 5.19 Calibrated DCO Frequencies, Tolerance
    20. 5.20 Wake-up Times From Lower-Power Modes (LPM3, LPM4)
    21. 5.21 Typical Characteristics, DCO Clock Wake-up Time From LPM3 or LPM4
    22. 5.22 Crystal Oscillator, XT1, Low-Frequency Mode
    23. 5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    24. 5.24 Timer_A
    25. 5.25 USCI (UART Mode)
    26. 5.26 USCI (SPI Master Mode)
    27. 5.27 USCI (SPI Slave Mode)
    28. 5.28 USCI (I2C Mode)
    29. 5.29 10-Bit ADC, Power Supply and Input Range Conditions (MSP430G2x33 Only)
    30. 5.30 10-Bit ADC, Built-In Voltage Reference (MSP430G2x33 Only)
    31. 5.31 10-Bit ADC, External Reference (MSP430G2x33 Only)
    32. 5.32 10-Bit ADC, Timing Parameters (MSP430G2x33 Only)
    33. 5.33 10-Bit ADC, Linearity Parameters (MSP430G2x33 Only)
    34. 5.34 10-Bit ADC, Temperature Sensor and Built-In VMID (MSP430G2x33 Only)
    35. 5.35 Flash Memory
    36. 5.36 RAM
    37. 5.37 JTAG and Spy-Bi-Wire Interface
    38. 5.38 JTAG Fuse
  6. 6Detailed Description
    1. 6.1  CPU
    2. 6.2  Instruction Set
    3. 6.3  Operating Modes
    4. 6.4  Interrupt Vector Addresses
    5. 6.5  Special Function Registers (SFRs)
    6. 6.6  Memory Organization
    7. 6.7  Bootloader (BSL)
    8. 6.8  Flash Memory
    9. 6.9  Peripherals
      1. 6.9.1 Oscillator and System Clock
      2. 6.9.2 Calibration Data Stored in Information Memory Segment A
      3. 6.9.3 Brownout
      4. 6.9.4 Digital I/O
      5. 6.9.5 WDT+ Watchdog Timer
      6. 6.9.6 Timer_A3 (TA0, TA1)
      7. 6.9.7 Universal Serial Communications Interface (USCI)
      8. 6.9.8 ADC10 (MSP430G2x33 Only)
      9. 6.9.9 Peripheral File Map
    10. 6.10 I/O Port Diagrams
      1. 6.10.1 Port P1 Pin Diagram: P1.0 to P1.2, Input/Output With Schmitt Trigger
      2. 6.10.2 Port P1 Pin Diagram: P1.3, Input/Output With Schmitt Trigger
      3. 6.10.3 Port P1 Pin Diagram: P1.4, Input/Output With Schmitt Trigger
      4. 6.10.4 Port P1 Pin Diagram: P1.5 to P1.7, Input/Output With Schmitt Trigger
      5. 6.10.5 Port P2 Pin Diagram: P2.0 to P2.5, Input/Output With Schmitt Trigger
      6. 6.10.6 Port P2 Pin Diagram: P2.6, Input/Output With Schmitt Trigger
      7. 6.10.7 Port P2 Pin Diagram: P2.7, Input/Output With Schmitt Trigger
      8. 6.10.8 Port P3 Pin Diagram: P3.0 to P3.7, Input/Output With Schmitt Trigger (RHB and PW28 Package Only)
  7. 7Device and Documentation Support
    1. 7.1 Getting Started and Next Steps
    2. 7.2 Device Nomenclature
    3. 7.3 Tools and Software
    4. 7.4 Documentation Support
    5. 7.5 Related Links
    6. 7.6 Community Resources
    7. 7.7 Trademarks
    8. 7.8 Electrostatic Discharge Caution
    9. 7.9 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.